Three-dimensional memory and preparation method thereof
A memory, three-dimensional technology, applied in the direction of semiconductor devices, electric solid-state devices, electrical components, etc., can solve the problems of reducing the retention of three-dimensional memory and reducing the storage reliability of the charge trapping layer
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[0026] For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are descriptions of exemplary embodiments of the application only, and are not intended to limit the scope of the application in any way.
[0027] The terminology used herein is for the purpose of describing particular exemplary embodiments and is not intended to be limiting. When used in this specification, the terms "comprises", "includes", "includes" and / or "includes" indicate the presence of said features, integers, elements, components and / or combinations thereof, but do not exclude The presence of one or more other features, integers, elements, components and / or combinations thereof.
[0028] The description herein is made with reference to schematic illustrations of exemplary embodiments. Exemplary embodiments disclosed herein should not be constru...
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