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Multi-base-island chip packaging structure and packaging method

A technology of packaging structure and packaging method, which is applied to semiconductor/solid-state device components, semiconductor devices, electrical components, etc., and can solve problems such as long production time

Pending Publication Date: 2021-05-18
HUAYUAN SEMICON SHENZHEN LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a multi-base island chip packaging structure and packaging method to solve the problem of too long production time

Method used

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  • Multi-base-island chip packaging structure and packaging method
  • Multi-base-island chip packaging structure and packaging method
  • Multi-base-island chip packaging structure and packaging method

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Embodiment Construction

[0070]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0071] In the description of the specification of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper part", "lower part", "upper end", "lower end", "lower surface" and "upper surface" are based on the drawings The orientations or positional relationships shown are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that...

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Abstract

The invention provides a multi-base-island chip packaging structure and packaging method. The multi-base-island chip packaging structure comprises a frame, M first target bare chips and M second target bare chips, and the frame comprises M base islands; different first target bare chips are arranged on different base islands, the M first target bare chips are the same bare chips, the centers of the M first target bare chips are sequentially distributed along a first direction, and the deflection angles of the M first target bare chips relative to the first direction are the same; different second target bare chips are arranged on different base islands, the M second target bare chips are the same bare chips, the centers of the M second target bare chips are sequentially distributed in the first direction, and the deflection angles of the M second target bare chips relative to the first direction are the same.

Description

technical field [0001] The invention relates to the field of chip packaging, in particular to a multi-base island chip packaging structure and packaging method. Background technique [0002] Semiconductor packaging refers to the process of packaging independent chips processed from tested wafers according to product models and functional requirements. The packaging process is: the wafer from the wafer factory is cut into small chips (Die) after the cutting process, and then the cut chip is mounted on the corresponding base island of the corresponding substrate, and then the ultra-fine metal (Die) is used to Gold, silver, copper) wires connect the bonding pads (Bond Pad) of the chip to the corresponding pins (Lead) of the substrate and form the required circuit; then the independent chip is molded by injection molding or epoxy resin Encapsulation protection, after plastic sealing, it needs to be cut, tinned, and packaged. After the packaging is completed, the finished produ...

Claims

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Application Information

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IPC IPC(8): H01L25/07H01L21/98H01L23/495H01L21/50
CPCH01L25/072H01L25/50H01L23/49503H01L23/49562H01L21/50H01L2224/48137H01L2224/49111H01L2224/0603
Inventor 汪金张超
Owner HUAYUAN SEMICON SHENZHEN LTD
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