Taiko ring recovery device of Taiko ring cutting machine table

Abstract

The invention discloses a Taiko ring recovery device of a Taiko ring cutting machine table. The Taiko ring recovery device comprises a lifting unit, wherein the lifting unit is arranged in a Taiko ring recovery barrel; an area between the top surface of the lifting unit and the top opening of the Taiko ring recovery barrel is a recovery area; a Taiko ring is collected into the recovery area from the top opening of the Taiko ring recovery barrel in a falling manner; and the top surface of the lifting unit has a vertical lifting function, the top surface of the lifting unit is highest when the Taiko ring is not collected in the recovery area, the top surface of the lifting unit is gradually lowered along with increase of the recycling number. According to the invention, the falling height of the Taiko ring can be lowered when the Taiko ring is recovered, so that the fragment rate can be reduced or basically no fragment is generated, and besides, the volume of the Taiko ring recovery device is not influenced. The Taiko ring recovery device can be cleaned in time before the Taiko ring recovery device is full, so that the defects of full alarm, sudden stop of a machine table and wafer rework caused by the full alarm can be overcome.

Description

technical field [0001] The invention relates to semiconductor integrated circuit manufacturing equipment, in particular to a Taiko ring recycling device of a Taiko ring cutting machine. Background technique [0002] In recent years, with the development of the semiconductor industry, higher requirements have been placed on the integration and reliability of chips, which requires chips to be smaller and thinner. Semiconductor silicon wafers for chip production, namely wafers, include 6 inches, 8 inches and 12 inches, and the larger the size of the silicon wafer, the more chips it produces, and the lower the manufacturing cost, so the 12-inch wafer is undoubtedly The mainstream direction of semiconductor chips. [0003] In the process of making 12-inch semiconductor silicon wafers, Taiko-type thinning methods are often used to thin the wafer. Taiko rings provide support for the wafers for backside wet etching and backside metallization, and then cut off the Taiko rings for su...

AI Technical Summary

Problems solved by technology

It can be seen that the height d101 of the outlet of the ring taking unit 102 from the bottom surface of the recycling bin 101 is not easy to set. If the height d101 is set too large, the drop height of the taiko ring 103 at the bottom of the recycling bin 101 will inevitably be reduced. Too large, it is easy to make these Taiko rings 103 generate fragments, that is, the fragmentation rate of the Taiko rings 103 in the final recovery bucket 101 will increase

[0007] And if the height d101 is reduced, the volume of the whole recovery bucket 101 is limited, and the situation of filling the Taiko ring 103 will appear soon

Moreover, in the existing machines, after the recycle bin 101 is filled with Taiko rings 103, an alarm will be generated and the machine will be shut down and cannot continue to work; meanwhile, the wafers that have not completed the ring cutting process in the machine also need to be reworked ( Rework), seriously affecting the production capacity of the machine

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