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Computer mainframe box with noise reduction function and heat dissipation function

A computer and main box technology, applied in the computer field, can solve the problems of dust, interference, and affecting the internal work of the CPU.

Pending Publication Date: 2021-04-27
张海鑫
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Question 1: The noise generated when the cooling fan rotates is the main source of chassis noise. At the same time, the vibration of the fan drives the chassis to vibrate, and the noise generated will interfere with the personnel near the chassis and affect their work and study.
[0006] Problem 2: The computer CPU generates heat when the computer CPU is working. If the heat is too high, it will damage the components. At present, the existing CPU cooling system has poor heat dissipation effect, slow heat transfer efficiency, and there is a lot of dust outside. If it enters the CPU, it will affect CPU inner workings

Method used

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  • Computer mainframe box with noise reduction function and heat dissipation function
  • Computer mainframe box with noise reduction function and heat dissipation function
  • Computer mainframe box with noise reduction function and heat dissipation function

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Embodiment Construction

[0078] The following will be combined with Figure 1-Figure 20 The present invention is described in detail, and the technical solutions in the embodiments of the present invention are clearly and completely described. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0079] Construct a main computer case with noise reduction and heat dissipation functions: the main computer case includes a case 1, a ventilation window 3 is arranged on the front of the case, and a noise reduction structure and a CPU heat dissipation system are arranged inside the main computer case.

[0080]The noise reduction structure includes a first support column 1-4, several first support columns 1-4 are fixedly installed at the bot...

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Abstract

A computer mainframe box with a noise reduction function and a heat dissipation function comprises a case body, a ventilation window is arranged on the front face of the case body, and a noise reduction structure and a CPU heat dissipation system are arranged in the computer mainframe box. According to the computer case, the cooling fan drives air to flow, the cooling efficiency is improved, the electrostatic net can block dust, then dust prevention can be conducted on the CPU body, the dust is prevented from entering the CPU body, noise in the case is eliminated through the sound absorption cotton on the periphery, the noise generated by air flowing is eliminated through the mute box, and the noise reduction effect is improved. Heat of the CPU is transferred into the cooling fins through the heat conduction plate, the heat conduction pipe evenly distributes the heat into each cooling fin, the heat is dispersed, and the heat generated in the working process of the CPU can be effectively reduced.

Description

technical field [0001] The invention relates to the field of computers, in particular to a main computer box with a noise reduction function and a heat dissipation function. Background technique [0002] The mainframe chassis of the computer is the chassis box used to place the core processing components of the computer. The CPU, display, power supply, etc. are installed in the chassis. These components will generate heat when the computer is running, especially when the computer is processing large data. A large amount of heat will be generated during sum calculation, and if the heat is not dissipated in time, it will cause the temperature inside the chassis to rise and affect the normal operation of the components in the chassis. The chassis of the prior art is generally provided with a heat dissipation port, and the air circulation around the components is increased through the heat dissipation fan arranged at the heating element, and the heat is dissipated in a manner of...

Claims

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Application Information

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IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20G06F2200/202
Inventor 张海鑫
Owner 张海鑫
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