Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of intelligent chip manufacturing equipment and manufacturing method

A technology for manufacturing equipment and smart chips, which is applied in semiconductor/solid-state device manufacturing, coating, and devices for coating liquid on the surface, etc., and can solve problems such as low dispensing efficiency

Active Publication Date: 2021-11-12
法诺信息产业有限公司 +1
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, for the dispensing of chips of different sizes, either the dispensing head needs to be replaced, or different trajectories need to be followed; when switching dispensing of chips of different sizes, the dispensing efficiency is low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of intelligent chip manufacturing equipment and manufacturing method
  • A kind of intelligent chip manufacturing equipment and manufacturing method
  • A kind of intelligent chip manufacturing equipment and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples or drawings are used to illustrate the present invention, but not to limit the scope of the present invention.

[0047] Such as figure 1As shown, it includes a motor 1, a frame body 2, a dispensing head 3, a control switch 4, a chip centering mechanism 5, a screw 21, a threaded sleeve 20, and a guide sleeve 14, among which image 3 As shown, the frame body 2 is composed of two parts, a horizontal plate and a vertical plate; as figure 1 As shown, the motor 1 is fixedly installed on the vertical plate, such as Figure 5 As shown, the upper end of the screw rod 21 is installed on the output shaft of the motor 1 through a coupling; the guide sleeve 14 is fixedly installed on the vertical plate, the threaded sleeve 20 is slidably installed on the guide sleeve 14, and the threaded sleeve ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of chip manufacturing, and in particular relates to an intelligent chip manufacturing equipment, which includes a motor, a frame, a dispensing head, a control switch, a chip centering mechanism, a screw, a threaded sleeve, and a guide sleeve. The isolation structure, the second isolation structure and the third isolation structure are distributed from top to bottom. By controlling the movement of the three isolation structures, it is possible to control whether the three isolation channels are glued; thus, it can adapt to the gluing of chips of different sizes; After the structure closes the corresponding return channel, the pneumatic module does work and blows air into the isolation structure. After the gas passes through the isolation structure, it blows the glue on the lower side of the isolation structure to make it flow out; blowing the glue out through the gas can prevent the glue from sticking to the back. In the type channel, there is a drawing phenomenon and the gluing can be completed quickly.

Description

technical field [0001] The invention belongs to the technical field of chip manufacturing, and in particular relates to an intelligent chip manufacturing device. Background technique [0002] In chip packaging, the chip needs to be packaged into the substrate, and a dispenser is needed at this time. When dispensing chips of different sizes, the types of dispensing machines generally used are also different; that is, a certain dispensing machine, especially for dispensing heads, can only dispense chips of one size; Chip dispensing machines generally adapt to different sizes of chips by changing the size of the dispensing head or track dispensing through a small dispensing head. The larger the chip, the more tracks. [0003] However, for the dispensing of chips of different sizes, either the dispensing head needs to be replaced, or different trajectories need to be followed; when switching dispensing of chips of different sizes, the dispensing efficiency is low. [0004] The...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C11/10B05C13/02H01L21/67
CPCB05C5/0208B05C11/1021B05C13/02H01L21/67126
Inventor 梁艳凤
Owner 法诺信息产业有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com