A device and method for preventing copper plating of conductive rollers

Abstract

The invention discloses a device and method for preventing copper plating of a conductive roller in the technical field of manufacturing electroplated copper films. After energizing, electroplate the coated product flowing through the plating solution in the plating tank, connect the conductive roller to the positive output end of the second power supply, and cooperate with the auxiliary electrode connected to the negative output end of the second power supply to realize the electrolysis of the conductive roller, so that the conductive roller Avoid copper deposits when electroplating coated products. On the premise that the conductive roller completes electroplating, the present invention can realize the electrolysis of the plating solution near the conductive roller, so that the balance between electroplating copper on the conductive roller and electrolytic copper process can be avoided, and copper residues on the conductive roller can be avoided, thereby improving the copper plating of coated products. quality, and the present invention will not increase the process steps of the electroplating process, and will not affect the realization of the electroplating process.

Description

A device and method for preventing copper plating of conductive rollers technical field The present invention relates to the manufacture technical field of electroplating copper film, specifically, relate to a kind of copper plating preventing conductive roller device and method. Background technique In the process of copper film electroplating, the surface of the coating film will have a certain plating solution, and when the coating film bypasses the conductive roller for electroplating [0002] During the plating process, when the coating film is in contact with the conductive roller, the plating solution will also contact the conductive roller, which will cause the electroplating solution and the conductive roller to generate electricity. The plating reaction causes a large area of ​​copper to be deposited on the surface of the conductive roller, which will have a relatively large impact on the production of the film. example For example, copper particles or coppe...

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Problems solved by technology

[0004] However, these existing physical methods can only remove the deposited copper that has formed on the surface of the conductive roller. First, it cannot completely remove the residual copper particles on the surface of the conductive roller, and cannot meet the requirements of non-metallic copper coating. Second, it will also affect the plating. The effective components of the liquid will affect the effect of copper plating, and such a copper removal method requires additional copper removal steps in the process of copper plating, making the equipment implementation process more cumbersome

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