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Heterogeneous temperature equalizing device

A device and heterogeneous technology, applied in the field of thermal management devices, can solve the problems of small heat flux and low vertical thermal conductivity

Pending Publication Date: 2021-04-09
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] As another aspect of the present invention, the present invention dissipates heat based on a multi-point distributed temperature chamber, which solves the problems of small heat flux and low vertical thermal conductivity of existing heat dissipation films such as graphite films

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A heterogeneous temperature uniform device to achieve foldable and efficient temperature uniform heat dissipation, such as figure 1 As shown, there are two vapor chambers 101 on the left and right, and a copper soft connection 102 connecting the two vapor chambers 101 .

[0037] In this embodiment, the vapor chamber 101 includes a copper upper shell plate 1 and a lower shell plate 2, such as figure 2 As shown, the upper shell plate 1 and the lower shell plate 2 form a cavity for accommodating a liquid-absorbing core 5, and the liquid-absorbing core 5 is loaded with heat-conducting medium water. The plane area of ​​a single vapor chamber is 25cm 2 , the thickness is 0.5mm.

[0038] Specifically, the following steps are used for assembly:

[0039] (1) Punching the copper foil of the raw material of the shell plate to obtain the upper shell plate 1 and the lower shell plate 2 with specific dimensions.

[0040] (2) The upper shell plate 1 and the lower shell plate 2 ob...

Embodiment 2

[0057] A heterogeneous temperature uniform device to achieve foldable and efficient temperature uniform heat dissipation, such as Figure 4 As shown, there are two vapor chambers 101 on the left and right, and a flexible connection 102 connecting the vapor chambers 101 .

[0058] In this embodiment, the vapor chamber 101 includes an aluminum upper shell plate 1 and a lower shell plate 2, the upper shell plate 1 and the lower shell plate 2 form a cavity for accommodating the liquid-absorbing core 5, and the liquid-absorbing core 5. Load heat conduction medium ethanol. The plane area of ​​a single vapor chamber is 25cm 2 , How much is the thickness of 0.3mm.

[0059] Specifically, the following steps are used for assembly:

[0060] (1) Punching the aluminum foil of the raw material of the shell plate to obtain the upper shell plate 1 and the lower shell plate 2 with specific dimensions.

[0061] (2) The upper shell plate 1 and the lower shell plate 2 obtained in step (1) are...

Embodiment 3

[0077] The main structure of this embodiment is the same as that of Implementation 1, and the similarities will not be repeated here. The difference is that: Figure 5 The flexible connection used is a 6-strand copper braided rope as shown.

[0078] The diameter of the copper wire is 10 μm, and each bundle contains 100 copper wires; the radial thermal conductivity of the flexible connection composed of 6 copper wire braided ropes is 380W / mK.

[0079] In this embodiment, the soft connection is connected to the vapor chamber 101 by means of cold pressure welding.

[0080] The heterogeneous temperature uniform device of this embodiment was subjected to a heat conduction test and a folding test. After 10 hours of testing, the temperature difference between the two temperature chambers did not exceed 8°C.

[0081] The number of times of bending resistance is more than 1000 times. Under 90° bending, the temperature difference between the two vapor chambers does not exceed 9°C; unde...

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Abstract

The invention relates to a heterogeneous temperature equalizing device, which comprises two planar temperature equalizing plates and a flexible connection part. The temperature equalizing plate is composed of an upper shell plate, a liquid absorbing core and a lower shell plate which are connected in sequence, a closed space is formed between the upper shell plate and the lower shell plate, the liquid absorbing core is located in the closed space, and the closed space is in a vacuum state and filled with a working media. And the temperature equalizing plates are connected through flexible connection. The upper shell plate and the lower shell plate are made of a flexible heat conduction material, the liquid absorbing core is made of a flexible porous material, and the flexible connection is made of metal or a carbonaceous membrane material and wire. The defect that a traditional temperature equalizing plate is poor in flexibility is overcome, and the heterogeneous temperature equalizing device can be used for thermal management of flexible electronic and foldable electronic products.

Description

technical field [0001] The invention relates to the field of heat management devices, in particular to a heterogeneous temperature uniform device. Background technique [0002] With the rapid development of microelectronics integration and assembly technology and the large-scale use of high power density components, the heat flux density of electronic products is becoming larger and larger, which seriously affects their quality stability and service life. Therefore, it is necessary to develop efficient thermal management system. On the other hand, wearable electronic devices, flexible displays, foldable hands, notebook computers and other products that have emerged in recent years require thermal management systems to be able to adapt to complex assembly environments in addition to requiring efficient and uniform temperature dissipation. Flexible, can be bent and even folded repeatedly. [0003] Most of the existing mainstream vapor chambers are planar rigid structures, wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20509Y02D10/00
Inventor 刘英军许震高超林佳豪
Owner ZHEJIANG UNIV
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