Machining die for heat-conducting silica gel pad and application method of machining die

A technology of thermally conductive silicone and processing molds, applied in metal processing and other directions, can solve the problems of poor deformation, difficult production, and large force on the entire surface of the thermally conductive silicone pad, achieving simple manufacturing, solving the limitations of processing shapes, and improving processing. range effect

Pending Publication Date: 2021-04-09
上海昊佰智造精密电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this kind of special-shaped silicone pad, it is necessary to design the trajectory of the cutter to be a special-shaped shape when using a cutter for processing, which is difficult to achieve in production.
[0005] Another production method for special-shaped thermal silica gel pads is die stamping, which is vertically punched and shaped at 90° up and down.

Method used

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  • Machining die for heat-conducting silica gel pad and application method of machining die
  • Machining die for heat-conducting silica gel pad and application method of machining die
  • Machining die for heat-conducting silica gel pad and application method of machining die

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Embodiment

[0038] A processing mold for a thermally conductive silicone pad, such as figure 2 As shown, the finished heat-conducting silicone pad for processing a circular shape includes a mold bottom plate 1, a triangular blade 2 on the surface of the mold bottom plate 1, a circular through-hole 3 on the mold bottom plate 1, and sliding installation The finished product ejector rod 5 in the through hole 3; the blade edge 2 is arranged along the periphery of the through hole 3, including the first blade surface and the second blade surface, and the angle between the two is less than 30°, and the peripheral circle of the through hole 3 Matches the roundness formed by the apex of the blade 2. The hole wall of the through hole 3 is perpendicular to the surface of the mold bottom plate 1, the first blade surface is arranged along the extension direction of the hole wall of the through hole 3, and the second blade surface forms an angle with the surface of the mold bottom plate 1, so the fir...

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PUM

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Abstract

The invention relates to a machining die for a heat-conducting silica gel pad. The machining die comprises a die bottom plate, a triangular blade point arranged on the surface of the die bottom plate, and a through hole formed in the die bottom plate, wherein the blade point is arranged along the periphery of the through hole and comprises a first blade face and a second blade face; the first blade face is arranged in the extending direction of the hole wall of the through hole; and an included angle is formed between the second blade face and the surface of the die bottom plate. Compared with the prior art, the machining die has the beneficial effects that the application range is wide, the product machining precision is reliable, the die is simple and easy to manufacture, and economic benefits are high.

Description

technical field [0001] The invention relates to the field of die cutters, in particular to a processing mold for a heat-conducting silicone pad and an application method thereof. Background technique [0002] Thermally conductive silicone pad has certain flexibility, excellent insulation, compressibility, and natural stickiness on the surface. It is specially produced for the design scheme of using gaps to transfer heat. It can fill the gaps and complete the heat transfer between the heating part and the cooling part. It plays the role of insulation and shock absorption, and can meet the design requirements of miniaturization and ultra-thinness of equipment. It is extremely manufacturable and usable, and has a wide range of thickness. It is an excellent thermal conductivity filling material and is widely used. in electrical and electronic products. [0003] The heat-conducting silicone pad deforms greatly under stress, so the shape of the normal heat-conducting pad is desig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/44
CPCB26F1/44
Inventor 杜月华蒋建国
Owner 上海昊佰智造精密电子股份有限公司
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