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Heat-conducting medium smearing device for CPU radiator copper sheet

A technology of heat conduction medium and radiator, which is applied to devices and coatings that apply liquid to the surface, which can solve problems such as low efficiency, uneven application, and increased production costs.

Active Publication Date: 2021-04-09
东莞市精崧五金电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]In order to overcome the disadvantages of uneven application, low efficiency and increased production cost of the factory in order to overcome manual production, the technical problem is: to provide a method that can realize automatic production and improve efficiency , cost-reduced CPU heatsink copper sheet heat-conducting medium coating device

Method used

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  • Heat-conducting medium smearing device for CPU radiator copper sheet
  • Heat-conducting medium smearing device for CPU radiator copper sheet
  • Heat-conducting medium smearing device for CPU radiator copper sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] A kind of CPU heat sink copper plate thermal conduction medium coating device, such as Figure 1-3 As shown, it includes a base plate 1, a support column 2, a workbench 3, a rotating mechanism 4 and a feeding mechanism 5. The base plate 1 is provided with three support columns 2, and a workbench 3 is connected between the tops of the support columns 2. The workbench 3 A rotating mechanism 4 is arranged on the top, and a feeding mechanism 5 is arranged on the right side of the workbench 3 .

[0069] The rotating mechanism 4 includes a first support frame 41, a first rotating shaft 42 and a cylinder 43. The front and rear sides of the left top of the workbench 3 are connected with the first support frame 41, and the left side of the first support frame 41 is rotatably connected with a The first rotating shaft 42 is provided with a roller 43 on the first rotating shaft 42 .

[0070] The feeding mechanism 5 includes a second support frame 51, a feeding frame 52 and a briqu...

Embodiment 2

[0073] On the basis of Example 1, such as Figure 4-9 As shown, a moving mechanism 6 is also included, and the moving mechanism 6 includes a first slide rail 61, a first slide block 62, a first spring 63 and a second spring 64, and the upper part of the loading frame 52 is connected with the first slide rail 61, The first slide block 62 is slidably connected between the front and rear sides of the first slide rail 61, and the first slide block 62 is slidably connected with the pressing block 53. First springs 63 are arranged between them, and second springs 64 are arranged between the left and right sides of the top of the first slider 62 and the top of the pressing block 53 .

[0074] When it is necessary to place the copper sheet of the CPU heat sink, first move the pressing block 53 upwards, so that the second spring 64 is stretched, and then move the pressing block 53 and the first slider 62 to the right, so that the first spring 63 is compressed, and the After the copper...

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Abstract

The invention relates to a smearing device, in particular to a heat-conducting medium smearing device for a CPU radiator copper sheet. The technical problem is to provide the heat-conducting medium smearing device for the CPU radiator copper sheet, which can realize automatic production, improve the efficiency and reduce the cost. According to the technical scheme, the heat-conducting medium smearing device for the CPU radiator copper sheet comprises a bottom plate, three supporting columns arranged on the bottom plate, a workbench connected among the tops of the supporting columns, a rotating mechanism arranged on the workbench, and a feeding mechanism arranged on one side of the workbench; and through cooperation of a moving mechanism, the rotating mechanism, a conveying mechanism and the feeding mechanism, it can be achieved that the CPU radiator copper sheet can be automatically pushed out, and a heat-conducting medium is smeared on the CPU radiator copper sheet.

Description

technical field [0001] The invention relates to a smearing device, in particular to a heat-conducting medium smearing device for a copper sheet of a CPU radiator. Background technique [0002] At present, in the process of making the copper sheet of the CPU radiator, it is necessary to apply a thermal medium on the surface of the copper sheet of the CPU radiator, so that the copper sheet of the CPU radiator can play its role. After applying the thermal medium, the thermal medium should be baked. Dry, so that the CPU heat sink copper and heat conduction medium into one. [0003] The current method of applying heat-conducting medium to the copper sheet of the CPU radiator is to manually apply it manually. There will be some problems in manual application: first, the uneven application will affect the quality of the copper sheet of the CPU radiator; second, The amount of smearing is relatively large, and it is inefficient to rely solely on manual smearing; thirdly, it increase...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C13/02
CPCB05C13/02
Inventor 肖红平
Owner 东莞市精崧五金电子有限公司
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