Large module MOV mounting assembly with explosion-proof and pressure-relief functions for MOV chip

Abstract

The invention discloses a large module MOV mounting assembly with explosion-proof and pressure-relief functions for an MOV chip. The MOV mounting assembly comprises a shell, a cover plate, a first limiting groove, a first limiting block, a first spring, a clamping block, a fixing block, a sleeve, a charging box, a second limiting groove, a jacking block, a second spring, a discharging hole, a material bag, a through hole, an insulating ring, a plug, a clamping block, a piezoresistor body, a pin, a pressure relief chamber, a connecting rod, a piston, a pressure relief hole, a through groove and a stop block. In comparison with the existingMOV mounting assembly, a replaceable flame-retardant device is designed, open fire generated by combustion of the piezoresistor can be prevented, fire hazards are reduced, a secondary pressure relief function is designed, pressure generated by high temperature can be safely released into the environment, and meanwhile sharp gas buzzing is generated at the pressure relief hole. As the plug-in piezoresistor mounting device, after the piezoresistor is damaged, the piezoresistor can be quickly replaced, and meanwhile, the shell can be repeatedly utilized.

Description

technical field [0001] The invention relates to the technical field of MOV mounting components, in particular to a large-module MOV mounting component with explosion-proof pressure relief for MOV chips. Background technique [0002] The MOV chip is a metal oxide resistor, such as a zinc oxide varistor, which is the core component of a surge protector, but when the existing zinc oxide varistor is broken down, the ceramic substrate will be perforated Melting, its center temperature will be as high as more than 1,000 degrees Celsius, and the external flame will ignite and penetrate the pressure-sensitive conventional epoxy resin encapsulation layer, causing the piezoresistor to burn and cause a fire. At the same time, the high temperature will cause the internal air pressure to increase. If the casing is burst, the existing zinc oxide varistor is damaged, and it is inconvenient to replace, and the installation components cannot be reused, which is relatively wasteful. Content...

AI Technical Summary

Problems solved by technology

[0002] The MOV chip is a metal oxide resistor, such as a zinc oxide varistor, which is the core component of a surge protector, but when the existing zinc oxide varistor is broken down, the ceramic substrate will be perforated Melting, its center temperature will be as high as more than 1,000 degrees Celsius, and the external flame will ignite and penetrate the pressure-sensitive conventional epoxy resin encapsulation layer, causing the piezoresistor to burn and cause a fire. At the same time, the high temperature will cause the internal air pressure to increase. Burst the shell, the existing zinc oxide varistor is damaged, it is inconvenient to replace, and the installation components cannot be reused, which is wasteful

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