In situ characterization method for bonding interface state under irradiation conditions

Abstract

The invention relates to an in-situ characterization method of the bonding interface state, in particular to an in-situ characterization method of the bonding interface state under irradiation conditions. The purpose of the present invention is to solve the problem of relying on large-scale special equipment such as radiation sources when using the radiographic flaw detection method in the existing method, the deployment of the service site is limited by space, and the convenience of use is insufficient. The protection requirements are high and it is difficult to meet the requirements of long-term use. When using structural dynamics analysis, the radiation resistance of the sensor and its pasting adhesive needs to be specially studied. It provides an in-situ bonded interface state under irradiation conditions. Characterization method. The method is mainly applied to nuclear power equipment related to irradiation conditions, and realizes non-contact, unmanned, simple, safe and reliable through the steps of bonding interface sampling, typical state calibration, and non-contact in-situ detection at the service site. , Timely characterization of the bonding interface state.

Description

technical field [0001] The invention relates to an in-situ characterization method of the bonding interface state, in particular to an in-situ characterization method of the bonding interface state under irradiation conditions. Background technique [0002] The adhesive structure is composed of different materials, which can simultaneously realize the functions of bearing, sealing, and heat protection in the field of engineering structures. The discontinuous feature of its geometric configuration and the strong discontinuity of its physical properties lead to high mechanical stress at the bonding interface and cause defects such as microcracks at the bonding interface. [0003] For the bonding interface of nuclear power pipeline structure and protective coating, the occurrence of defects such as microcracks will cause the deviation between the service state and the design state, and seriously affect the service reliability. Characterization has become the basic requirement ...

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to solve the problem that when the existing in-situ characterization method of the bonded interface state under irradiation conditions adopts the radiographic flaw detection method, it relies on large-scale special equipment such as radiation sources, the deployment of the service site is limited by space, and the convenience of use is insufficient; When using the flaw detection method, the requirements for personnel protection under irradiation conditions are high and it is difficult to meet the requirements for long-term use; when using structural dynamics analysis, the radiation resistance of the sensor and its adhesive for pasting needs to be specially studied. In Situ Characterization Method of Adhesive Interface State under Illumination Conditions