Preparation method of nested structure

Abstract

The invention relates to the technical field of packaging injection molding and discloses a preparation method of a nested structure. The preparation method comprises the following steps of preparinga first female die and a second female die; respectively forming a first sub-die and a second sub-die through the first female die and the second female die; placing an insert between the first sub-die and the second sub-die, assembling the first sub-die and the second sub-die, and pressing the insert by the first sub-die and the second sub-die; and carrying out injection molding on a first closedcavity formed by the first sub-die and the second sub-die after die assembly to form the nested structure, wherein the first sub-die and the second sub-die are made of soft materials. The preparationmethod of the nested structure is simple, specific equipment and conditions are not needed, the surface of the insert can be well protected from being covered by an injection molding material, and the insert can be well protected from being crushed.

Description

technical field [0001] The invention relates to the technical field of encapsulation and injection molding, in particular to a preparation method of a nested structure. Background technique [0002] The insert injection molding process means that before injection molding, inserts of different materials are placed in advance, and after they are placed in place, the injection mold starts to close the mold and continue to form. During this period, the injection molding material in the molten state is combined with the insert to become an integrated product. special injection molding process. In the past, insert injection molding, which was widely used in the industry, was nested metal parts. These product types often belonged to large-scale device equipment. Moreover, rapid prototyping packaging technology often required specific equipment and conditions (such as special wavelength light / laser irradiation) , temperature, pressure, etc.), such production is more difficult, and ...

AI Technical Summary

Problems solved by technology

In the past, insert injection molding, which was widely used in the industry, was nested metal parts. These product types often belonged to large-scale device equipment. Moreover, rapid prototyping packaging technology often required specific equipment and conditions (such as special wavelength light / laser irradiation) , temperature, pressure, etc.), such production is more difficult, and the technical methods are cumbersome and complicated, and the technical process requirements are high

Images