A chip packaging system

Abstract

The invention discloses a chip packaging system, comprising a base, a riser is fixedly connected to the top of the base near the rear side, a No. 1 motor is installed on the rear side of the riser, and the output shaft of the No. 1 motor runs through the riser , and is fixedly connected with an outer cylinder, the top of the outer cylinder is open, the middle part of one side of the outer cylinder is open, and the outer cylinder at the bottom of the middle opening is provided with a bar-shaped outlet; the invention makes the outer cylinder in a horizontal state, and the worker who puts the shell in one On one side, the workers who place the chips are in the middle, and the workers who apply glue and take out the chips are on the other side. Rotate to the vertical state, and the application of the glue will not be affected after being placed vertically. At the same time, the semicircular plate is in the initial heating state during the application process. After the application is completed, the shell and the chip are quickly approached to the heating element. Improve packaging efficiency.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, in particular to a chip packaging system. Background technique [0002] The shell used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and it is also a bridge to communicate the internal world of the chip with the external circuit - the contacts on the chip are connected to the packaging shell with wires On the pins, these pins are connected to other devices through the wires on the printed board. Therefore, packaging plays an important role for both CPUs and other LSI integrated circuits. [0003] When packaging the chip, it is necessary to apply glue between the chip and the shell and then heat seal it. When the chip and the shell are assembled and heat-sealed in the horizontal direction, the glue is not easy to apply. When the chip and the shell are assembled in the vertic...

AI Technical Summary

Problems solved by technology

[0003] When packaging the chip, it is necessary to apply glue between the chip and the shell and then heat seal it. When the chip and the shell are assembled and heat-sealed in the horizontal direction, the glue is not easy to apply. When the chip and the shell are assembled in the vertical direction and heat-sealed, It is necessary to apply glue on the surface of the chip before placing the shell. It is impossible to put both at the same time, which may easily cause the late-placed parts to not be put in in time, which not only affects the efficiency of packaging, but also causes the loss of parts.

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