Mainboard, noise reduction method and terminal

A motherboard and noise technology, applied in the reduction of crosstalk/noise/electromagnetic interference (, sounding equipment, measuring ultrasonic/sonic/infrasonic waves, etc., can solve audio noise and other problems, and achieve the effect of solving audio noise and reducing audio noise

Pending Publication Date: 2021-03-09
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

When the power supply voltage fluctuates, the capacitor will mechanically expand and contract with the voltage change, and drive the PCB motherboard to vibrate regularly. The frequency of the vibration falls into the range that the human ear can capture, resulting in audio noise.

Method used

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  • Mainboard, noise reduction method and terminal
  • Mainboard, noise reduction method and terminal
  • Mainboard, noise reduction method and terminal

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Embodiment Construction

[0018] In order to make the purpose, technical solution and advantages of the application clearer, the embodiments of the application will be described in detail below in conjunction with the accompanying drawings. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined arbitrarily with each other.

[0019] In an exemplary embodiment, the present application provides a motherboard, Figure 1a It is a schematic structural diagram of a mainboard provided in this application. The board can be integrated in any type of terminal, such as a smartphone.

[0020] At present, the main solutions to the audio noise caused by filter capacitors mainly include the following two aspects: one is to optimize the hardware circuit design. By optimizing the layout of the device, such as the mutual position between the filter capacitors; optimizing the circuit design, reducing the voltage fluctuation on th...

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Abstract

The invention provides a mainboard, a noise reduction method and a terminal. The mainboard comprises a support piece and a filter capacitor, wherein the filter capacitor is mounted on the supporting piece; the surface of the filter capacitor is covered with a cured liquid resistance-capacitance layer, and the liquid resistance-capacitance layer comprises a liquid resistance-capacitance material; and the liquid resistance-capacitance layer is used for reducing noise generated by the filtering capacitor at the sound production position of the supporting piece.

Description

technical field [0001] The present application relates to the technical field of packaging of electronic devices, in particular to a motherboard, a noise reduction method and a terminal. Background technique [0002] At present, multiple filter capacitors are integrated on the PCB (Printed Circuit Board, printed circuit board) power network in various terminals, and some filter capacitors have significant piezoelectric effects. When the power supply voltage fluctuates, the capacitor will mechanically expand and contract with the voltage change, and drive the PCB motherboard to vibrate regularly. The frequency of the vibration falls into the range that the human ear can capture, resulting in audio noise. As the motherboard becomes thinner and the output power gradually increases, especially after the emergence of 5G terminals, there will be stricter requirements on the shape and size of the whole machine, and this problem will become more prominent. Contents of the inventio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/02H05K3/28G01H17/00G10K11/16
CPCG01H17/00G10K11/16H05K1/0216H05K1/181H05K3/284H05K1/02H05K1/18H05K3/28
Inventor 林雪
Owner ZTE CORP
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