Test fixture for broadband radio frequency BGA interface system-in-package product

Abstract

The invention discloses a test fixture for a broadband radio frequency BGA interface system-in-package product. The test fixture comprises a pressure applying device, a test fixture base, a test mother board, an elastic diaphragm and a positioning mechanism; the pressure applying device comprises a guide mechanism, a pressing plate, a spinning nut and a screwing handle; a guide groove is formed inthe guide mechanism, and a threaded hole matched with the spinning nut is formed in the upper part of the guide groove; the pressing plate is installed in the guide groove, and the spinning nut is arranged in the threaded hole. And the screwing handle is used for screwing the spinning nut. According to the pressure applying device, one spinning nut is adopted to apply pressure to the pressing plate, the pressing plate applies pressure to the BGA packaging product to be tested stably and uniformly in the pressing process, the compression amount of each BGA solder ball on the BGA packaging product to be tested to the elastic diaphragm is consistent, and radio frequency signal communication is stable and reliable.

Description

technical field [0001] The invention relates to the field of microwave and millimeter wave components and device testing, in particular to a test fixture for broadband radio frequency BGA interface system-level packaging products. Background technique [0002] In RF product testing, with the emergence of broadband RF BGA interface system-in-package products, it is necessary to test the RF performance of BGA-packaged RF products of various sizes. The key to the RF performance test fixture of BGA package products is the alignment of the RF interconnection between the BGA ball and the fixture, and the stability of the signal connection. [0003] The current common interconnection methods mainly include: [0004] (1) Elastic probe connection form, the probes are arranged in an array to realize the connection between each BGA ball and the test fixture motherboard. This connection form has been widely used in low-frequency digital BGA packaging products, and elastic probes are us...

AI Technical Summary

Problems solved by technology

[0007] 1) Every time you disassemble and assemble a BGA package product, you need to remove 4 wing nuts and pressure plates, and then install them again, which is inefficient in disassembly and assembly;

[0008] 2) The elastic diaphragm is relatively thin, and the amount of pressing down is small, so it is required to apply pressure evenly. In fact, the pressure of the pressure plate is applied by 4 wing nuts. It is impossible to screw the 4 nuts at the same time in this scheme, so it is impossible to achieve uniformity. The purpose of pressurization, so the pressurization scheme is less stable

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