Packaging and shaping device for bagged FOSBs sealed by ultrasonic waves

Abstract

The invention discloses a packaging and shaping device for bagged FOSBs sealed by ultrasonic waves. The packaging and shaping device comprises an integral machine frame, a FOSB conveying belt, an opening clamping device, an ultrasonic sealing device, a FOSB front end shaping device, a sealing station horizontal driving device and a FOSB back side face shaping device. The integral machine frame comprises a shaping station bottom machine frame, a shaping station rear machine frame, a shaping station front machine frame, a sealing station lower machine frame and a sealing station upper machine frame, the FOSB conveying belt is mounted on the shaping station bottom machine frame, the shaping station rear machine frame and the sealing station lower machine frame are located on the shaping station bottom machine frame; and the shaping station front side machine frame is fixed to the shaping station rear side machine frame, and the FOSB front end shaping device and the FOSB back side face shaping device are both mounted on the shaping station front side machine frame. According to the packaging and shaping device for the bagged FOSBs sealed by the ultrasonic waves, bagged FOSB packaging bags can be vacuumized and automatically shaped, the shaping efficiency is improved, the whole process is fully automatically carried out, and the labor cost is reduced.

Description

technical field [0001] The invention relates to the field of FOSB packaging, in particular to a packaging and shaping device for bagged FOSB sealed by ultrasonic waves. Background technique [0002] Wafer refers to a silicon chip made of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. A wafer is a carrier used in the production of integrated circuits. A wafer in the general sense basically refers to It is a single crystal silicon wafer. The single crystal silicon wafer is refined from ordinary silicon sand. After being dissolved, purified, and distilled, it supports a single crystal silicon rod. After the single crystal silicon rod is polished and sliced, it becomes a wafer. With the continuous development of integrated circuit manufacturing technology, the feature size of the chip is getting smaller and smaller, the number of interconnection layers is increasing, and the diameter of the wafer is also increasing. To achieve mul...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of low efficiency and low degree of automation caused by manual shaping of the existing FOSB bagging packaging bags, and proposes a bagging FOSB packaging shaping device that uses ultrasonic sealing, which can automatically realize Vacuuming and automatic shaping of FOSB bags after bagging improves shaping efficiency

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