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Deep cryogenic temperature control system for power devices

A technology for temperature control systems and power devices, applied in semiconductor devices, electric solid state devices, semiconductor/solid state device components, etc., and can solve problems such as lack of deep and low temperature background cooling systems

Active Publication Date: 2021-07-09
无锡中科德芯感知科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a deep low temperature temperature control system for power devices in order to overcome the lack of a cooling system suitable for deep space probe ground simulation in the deep low temperature background in the prior art

Method used

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Embodiment 1

[0067]In order to overcome the above-mentioned defects currently existing, this embodiment provides a cryogenic temperature control system for power devices. The cryogenic temperature control system includes: a liquid storage tank for storing various At least one of the cooling liquids; a gas supply module connected to the liquid storage tank and used to provide compressed gases of different pressures into the liquid storage tank to squeeze out the cooling liquid in the liquid storage tank; a fluid pipeline, connected to the liquid storage tank, and used to flow the cooling liquid squeezed out of the liquid storage tank to a target heat load according to different flow rates, so as to cool the target heat load , the flow rate of the cooling liquid in the fluid pipeline is associated with the pressure of the compressed gas provided by the gas supply module; and, a control module is connected in communication with the gas supply module and the target heat load, respectively , an...

Embodiment 2

[0076] On the basis of Embodiment 1, this embodiment provides a cryogenic temperature control system for power devices, and the cryogenic temperature control system includes a testing device.

[0077] Such as figure 1 As shown, the test device mainly includes a gas supply module, a liquid storage tank 6 , a fluid pipeline 8 , a filling valve 7 , a control module 10 , a liquid outlet valve 11 , a heat exchanger 12 and a gas mass flow meter 13 .

[0078] Specifically, the gas supply module mainly includes a gas source 1 , a gas pipeline 2 , an electronically controlled pressure regulating valve 3 , a barometer 4 and an air release valve 5 .

[0079] Such as figure 1 As shown, the gas pipeline 2 is respectively connected with the gas source 1, the electronically controlled pressure regulating valve 3, the air pressure gauge 4 and the air release valve 5 through hydraulic joints (not shown in the figure) to ensure the airtightness of the gas pipeline.

[0080] Specifically, the ...

Embodiment 3

[0106] On the basis of Embodiment 1 and Embodiment 2, this embodiment provides a cryogenic temperature control system for power devices, the cryogenic temperature control system includes an operating device.

[0107] Such as figure 2 As shown, the main difference between the operating device of this embodiment and the test device of embodiment 2 is: the operating device also includes a liquid collection tank 14, but does not include the heat exchanger 12 and the gas mass flow rate of the test device of embodiment 2 Count 13. In this embodiment, other components of the operating device are basically the same or similar to the testing device in Embodiment 2, so details are not described again.

[0108]In this embodiment, the liquid outlet valve 11 is connected to the low-temperature fluid pipeline 8 through a hydraulic joint, and the low-temperature fluid pipeline 8 directly extends into the liquid collection tank 14 .

[0109] The liquid collection tank 14 is used to collect...

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Abstract

The invention discloses a deep low temperature temperature control system for power devices, comprising: a liquid storage tank storing at least one of various cooling liquids suitable for different temperature zones; a gas supply module connected with the liquid storage tank , and provide compressed gas of different pressures to the liquid storage tank to squeeze out the coolant in the liquid storage tank; the fluid pipeline is connected to the liquid storage tank, and according to different flow rates, the coolant squeezed out from the liquid storage tank The coolant flows to the heat load to cool the heat load, and the flow rate of the coolant in the fluid pipeline is related to the pressure of the compressed gas provided by the gas supply module; the control module is respectively connected to the gas supply module and the heat load , and control the pressure of the compressed gas provided by the gas supply module to the liquid storage tank according to the acquired heating power of the heat load, so as to control the flow rate of the cooling liquid flowing in the fluid pipeline. The invention cools heat loads by extruding different kinds of cooling fluids through air pressure.

Description

technical field [0001] The invention relates to the technical field of refrigeration, in particular to a deep low temperature temperature control system for high-power devices. Background technique [0002] With the further development of space technology in various countries in the world and the increase of deep space exploration activities, the ground simulation of deep space exploration and the low temperature work requirements of related detectors are also further increasing. Due to the low temperature background characteristics of deep space exploration, the demand for deep low temperature for related ground simulation and detector testing has further increased. [0003] Taking lunar exploration as an example, the Shackleton crater, which is located near the moon's rotation axis, has a permanently shadowed bottom and a temperature as low as 88K, so it is rich in water ice and various volatiles. ideal place. The simulation for such scenarios focuses on the ground simul...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/473
CPCH01L23/473
Inventor 刘大福李雪
Owner 无锡中科德芯感知科技有限公司
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