Label moving and pasting mechanism and label moving and pasting method for electronic components

Abstract

The invention discloses a label moving and pasting mechanism for electronic components. The label moving and pasting mechanism comprises a fixing plate, a two-degree-of-freedom moving mechanism, a label sucking needle, a vertical plate, a winding wheel, a pre-pasting wheel, a lifting air cylinder, a containing block, a rotating motor and a cutting knife; the vertical plate is arranged on the fixing plate, and the winding wheel is hinged to the vertical plate; the pre-pasting wheel is hinged to the vertical plate, a motor is arranged on the pre-pasting wheel, and the motor drives the pre-pasting wheel to move intermittently; material placing plates which are uniformly distributed are arranged on the periphery of the pre-pasting wheel; the rotating motor is installed on the fixing plate, andthe cutting knife is eccentrically installed at the rotating end of the rotating motor; the lifting air cylinder is installed on the fixing plate; and the two-degree-of-freedom moving mechanism is arranged on the fixing plate, and the label sucking needle is installed on a moving part of the two-degree-of-freedom moving mechanism. The label moving and pasting mechanism has the advantages of beinghigh in cutting efficiency and high in circular feeding efficiency.

Description

technical field [0001] The invention relates to the technical field of packaging production of electronic components, in particular to a label transfer mechanism for electronic components and a package inspection system for electronic components. Background technique [0002] Carrier tape is mainly used in the electronic component placement industry. It is used with the cover tape (top sealing tape), and stores electronic components such as resistors, capacitors, transistors, diodes, etc. in the pocket of the carrier tape, and forms a closed package by sealing the cover tape above the carrier tape. Protect electronic components from contamination and damage during transportation. When electronic components are placed, the cover tape is peeled off, and the automatic placement equipment takes out the components contained in the pockets sequentially through the precise positioning of the index hole of the carrier tape, and sticks them on the integrated circuit board (PCB board...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to propose a label transfer mechanism and an electronic component detection mechanism for electronic components with high cutting efficiency and high cycle feeding efficiency, aiming at the problem that the label needs to be cut and removed and the sticking efficiency is low in the prior art. package system

Images