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Method for preparing millimeter-scale deep microholes in quartz glass by using femtosecond laser filament effect

A technology of quartz glass and femtosecond laser, which is applied in the direction of laser welding equipment, welding equipment, manufacturing tools, etc., can solve the problems of lower product performance, difficulty in high-precision micro-holes, lack of function and precision, etc., and achieve large-scale processing , High energy utilization rate, high processing efficiency

Active Publication Date: 2021-11-09
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional drilling methods include mechanical drilling, electric spark drilling, electron beam drilling, etc., all have certain limitations, especially on some special materials, such as glass, it is particularly difficult to process high-precision micro-holes with traditional methods; The advanced drilling process is far from meeting the requirements of deep micro-hole processing for key parts of many high-precision products, and the performance of the product is greatly reduced due to the lack of specific functions and precision required by it.

Method used

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  • Method for preparing millimeter-scale deep microholes in quartz glass by using femtosecond laser filament effect
  • Method for preparing millimeter-scale deep microholes in quartz glass by using femtosecond laser filament effect
  • Method for preparing millimeter-scale deep microholes in quartz glass by using femtosecond laser filament effect

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Experimental program
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Effect test

Embodiment 1

[0023] Embodiment 1, a kind of method that utilizes femtosecond laser filament effect to prepare the quartz glass millimeter level deep microhole, comprises the following steps:

[0024] 1) Select an area of ​​5×20mm 2 , a quartz glass sample with a thickness of 5 mm, its surface is ultrasonically cleaned with acetone, absolute ethanol and deionized water, and then dried with dry air to obtain a clean quartz glass sample;

[0025] 2) Build an optical path, such as figure 2 As shown, the optical path includes a femtosecond laser 1, the output light of the femtosecond laser 1 passes through the reflector 2 to turn the optical path by 90°, and the reflected light passes through the half-wave plate 3, the beam splitting prism 4, the shutter 5, the reflector 6, and the aperture diaphragm in sequence 7. The plano-convex lens 8 and the λ / 4 wave plate 9 are vertically irradiated on the processing station of the mobile stage 10. The femtosecond laser 1, the shutter 5, and the mobile ...

Embodiment 2

[0031] In Example 2, the combination of processing parameters in Step 5) of Example 1 was changed to: laser power of 2.4W, defocus of -2mm, processing time of 23s, diameter of aperture stop 7 of 12mm, and circularly polarized light processing. Its processing effect refers to Figure 4 As shown, millimeter-scale deep micropores with an entrance aperture of 221 μm, a pore depth of 1220 μm, a depth-to-diameter ratio of 5.5:1, a taper of 5.19°, and a roundness of 88.2% were obtained, and the surface of the micropore was basically free of damage.

[0032] The beneficial effects of this embodiment are: Figure 4 , the depth of the deep micropores of the quartz glass obtained in this embodiment is slightly increased compared with Example 1 but remains almost unchanged. The hole taper is slightly increased; this kind of deep microhole is suitable for the manufacture of deep microholes that require large opening diameters, such as quartz glass microchannel diversion holes that require...

Embodiment 3

[0033] In Example 3, the combination of processing parameters in Step 5) of Example 1 was changed to: laser power of 2W, defocus of 0mm, processing time of 17s, diameter of aperture stop 7 of 12mm, and circularly polarized light processing. Its processing effect refers to Figure 5 As shown, millimeter-scale deep micropores with an entrance aperture of 195 μm, a pore depth of 1025 μm, a depth-to-diameter ratio of 5.3:1, a taper of 5.44°, and a roundness of 88.5% were obtained, and the surface of the micropore was basically free of damage.

[0034] The beneficial effects of this embodiment are: Figure 5 , the deep micropore depth of the quartz glass obtained in this embodiment is reduced compared with Example 1, but still can reach the millimeter level, and the reduction rate of the micropore depth is greater than the reduction rate of the micropore opening diameter, so the taper of the deep microhole increases. This structure It is the smallest experimental parameter to achi...

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Abstract

A method for preparing millimeter-scale deep micropores in quartz glass by using the femtosecond laser filament effect. Firstly, the quartz glass sample is cleaned, and then the optical path is built. , and finally focus the circular spot laser beam through a plano-convex lens with a large focal length, so that the femtosecond laser filament is irradiated vertically on the processing station of the moving stage. The femtosecond laser, shutter, moving stage and computer are connected, and the The computer adjusts the femtosecond laser to output different laser parameters to control the length of the femtosecond laser filament and the action time; the quartz glass sample is fixed on the processing station of the mobile stage, and after the femtosecond laser is irradiated, the computer controls the moving object along the Move in the vertical direction to change the defocus amount, thereby changing the position of the light filament in the material, and finally obtain deep microholes; the invention is simple in operation, high in processing efficiency, and does not require complicated post-processing processes.

Description

technical field [0001] The invention belongs to the technical field of femtosecond laser micromachining, and in particular relates to a method for preparing millimeter-scale deep microholes in quartz glass by utilizing the femtosecond laser light filament effect. Background technique [0002] In recent years, in the fields of microfluidic device manufacturing and electronic packaging, there has been an increasing demand for high-precision deep micro-hole processing of transparent hard and brittle materials. In the field of precision processing, especially the size and quality of micro-deep holes requirements. Traditional drilling methods include mechanical drilling, electric spark drilling, electron beam drilling, etc., all have certain limitations, especially on some special materials, such as glass, it is particularly difficult to process high-precision micro-holes with traditional methods; The advanced drilling process is far from meeting the requirements of deep micro-h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/382B23K26/60
CPCB23K26/382B23K26/60
Inventor 王文君廖恺梅雪松崔健磊刘斌李国基
Owner XI AN JIAOTONG UNIV
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