LED waterproof packaging structure and packaging process

A packaging structure, LED lamp bead technology, applied in the cooling/heating device, lighting device, fixed lighting device and other directions of lighting devices, can solve the problems of light source corrosion, large practical size of LED lights, damage, etc., to solve aging deterioration, The effect of increasing the contact area and extending the overall life

Inactive Publication Date: 2021-02-12
方桓周
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a LED waterproof packaging structure and packaging process to solve the problem that most of the LED lamp beads on the market are sealed by integral casting for waterproofing in the above-mentioned background technology, but the biggest problem of LED lights is heat dissipation, especially long-term lighting. The high-power LED lights that are used continuously for a long time, due to their high heat generation, the heat dissipation effect directly affects the service life of the lights. At present, most of the heat dissipation methods used by LED lights on the market are to use heat sinks to attach to the lamp holder. Direct convection heat dissipation with the air. Usually, when the LED lamp is used, it is mounted inside other electrical components. The air circulation is not good, and the surface of the lamp bead cannot be dissipated. The heat dissipation effect is negligible. The long-term high temperature makes the lamp bead yellow and dark. Finally, the life of the lamp bead is affected; a small part of the fan is installed inside the lamp body to directly dissipate heat from the aluminum alloy heat sink, resulting in an oversized structure of the LED lamp, poor practicality, and more power consumption during use; secondly, the above two heat dissipation methods lead to The waterproof effect of the LED light is poor, and the internal light source will slowly corrode and light decay after entering the water until the whole light is damaged

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED waterproof packaging structure and packaging process
  • LED waterproof packaging structure and packaging process
  • LED waterproof packaging structure and packaging process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0041] see Figure 1-12 , the present invention provides a technical solution: an LED waterproof packaging structure and packaging process, including LED lamp beads 11, crystal-bonding adhesive 12 and lens 13, LED lamp beads 11 are fixedly connected to the upper surface of crystal-bonding adhesive 12, characterized in that : Including flat pressure mechanism 2, carrier mechanism 3, heat dissipation mechanism 4 and sealing mechanism 5, flat pressure mechanism 2 is f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an LED waterproof packaging structure and packaging process in the technical field of LED waterproof packaging. The LED waterproof packaging structure comprises an LED lamp bead, a die bonding adhesive and a lens, wherein the LED lamp bead is fixedly connected to the upper surface of the die bonding adhesive. The LED waterproof packaging structure comprises a flat pressingmechanism, a carrier mechanism, a heat dissipation mechanism and a sealing mechanism, wherein the flat pressing mechanism is fixedly installed on the lower surface of the die bonding adhesive, the flat pressing mechanism is fixedly installed on the upper surface of the carrier mechanism, the heat dissipation mechanism is fixedly connected into the loading mechanism, the sealing mechanism is fixedly arranged between the heat dissipation mechanism and the carrier mechanism in a sleeving mode, and the lens is fixedly arranged on the upper surface of the carrier mechanism and located on the uppersides of the LED lamp bead. Along with the consensus of developing low-carbon economy globally and the functional advantages of the LED lighting industry in the fields of energy conservation and consumption reduction, an LED lamp on the current market adopts an integrated packaging form, colloid is aged and deteriorated after long-term use, the LED is not waterproof and poor in heat dissipation, and the LED waterproof packaging structure solves the problems of waterproofness and heat dissipation of the LED.

Description

technical field [0001] The invention relates to the field of LED waterproof packaging, in particular to an LED waterproof packaging structure and a packaging process. Background technique [0002] With the global consensus on the development of a low-carbon economy, the LED lighting industry has become an important new lighting source in the 21st century by virtue of its functional advantages in the field of energy saving and consumption reduction. Its application layout has also replaced many traditional light source application scenarios and is widely used It is used in various indications, displays, decorations, backlights, general lighting and urban scene lighting and other fields. In the development of LED lighting industry, field lighting has become a branch that develops rapidly. Using LED lamps as outdoor lighting fixtures means to ensure that the LEDs can work stably for a long time under harsh conditions in the field, so the waterproof technology of the lamps is e...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): F21S8/00F21V5/04F21V17/10F21V17/12F21V19/00F21V27/00F21V29/56F21V29/67F21V29/70F21Y115/10
CPCF21S8/00F21V5/04F21V17/101F21V17/12F21V19/002F21V27/00F21V29/56F21V29/67F21V29/70F21Y2115/10
Inventor 方桓周
Owner 方桓周
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products