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Heating element, micro-heater and preparation method of micro-heater

A heating element and micro heater technology, applied in heating elements, heating element materials, ohmic resistance heating parts, etc., can solve problems such as poor stability and short service life, and achieve good high temperature stability, long service life, and cold state. Good resistance value stability

Inactive Publication Date: 2021-02-02
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a heating element, a micro heater and a preparation method thereof, which are used to solve the problems of poor stability and short service life of the heating element in the prior art

Method used

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Embodiment 1

[0062] Please refer to figure 1 , the invention provides a kind of preparation method of heating element, the preparation method of described heating element comprises the following steps:

[0063] 1) providing a substrate;

[0064] 2) forming an adhesive layer on the upper surface of the substrate, and forming a heating element main body layer on the upper surface of the adhesive layer;

[0065] 3) forming a covering layer on the surface of the heating element main body layer, the covering layer covering the heating element main body layer and the adhesive layer.

[0066] In step 1), please refer to figure 1 Step S1 in and figure 2 , providing a substrate 1 .

[0067] As an example, the substrate 1 may include but not limited to a silicon substrate; preferably, the substrate 1 may include an N-type single throw or double throw single crystal silicon substrate; more preferably, in this implementation, the The substrate 1 can be an N-type single-polished or double-polishe...

Embodiment 2

[0081] read on Figure 2 to Figure 4 , the present invention also provides a heating element, the heating element includes: an adhesive layer 2; a heating element main body layer 3, the heating element main body layer 3 is located on the upper surface of the adhesive layer 2; a covering layer 4, the The cover layer 4 covers the adhesive layer 2 and the heating element main body layer 3 .

[0082] As an example, the heating element can be formed on a substrate, and the substrate 1 can include but not limited to a silicon substrate; preferably, the substrate 1 can include an N-type single throw or double throw single crystal silicon substrate More preferably, in this implementation, the substrate 1 may be an N-type single- or double-throw single crystal silicon substrate with (100) or (111) crystal orientation.

[0083] As an example, the material of the adhesion layer 2 may include but not limited to tantalum (Ta). For example, the material of the adhesion layer 2 may be titan...

Embodiment 3

[0091] Please refer to Figure 5 , the present invention also provides a kind of preparation method of micro-heater, the preparation method of described micro-heater comprises:

[0092] 1) Provide a substrate:

[0093] 2) forming a support layer on the upper surface of the substrate;

[0094] 3) forming an adhesive layer on the upper surface of the support layer, and forming a heating element main body layer on the upper surface of the adhesive layer;

[0095] 4) forming a covering layer on the surface of the heating element main body layer, the covering layer covering the heating element main body layer and the adhesive layer;

[0096] 5) forming test electrodes on the upper surface of the support layer and the upper surface of the covering layer;

[0097] 6) Etching the support layer to form a main support layer, a peripheral support layer and a support beam, the peripheral support layer is located at the periphery of the main support layer and has a gap with the main sup...

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Abstract

The invention provides a heating element, a micro-heater and a preparation method of a heating element. The preparation method of the heating element comprises the following steps: 1) providing a substrate; 2) forming an adhesive layer on the upper surface of the substrate, and forming a heating element main body layer on the upper surface of the adhesive layer; and 3) forming a covering layer onthe surface of the heating element main body layer, wherein the covering layer covers the heating element main body layer and the adhesion layer. By arranging the adhesion layer and the covering layerin the heating element and the micro-heater, the heating element and the micro-heater have the advantages of being good in high-temperature stability, good in cold-state resistance value stability, long in service life and the like.

Description

technical field [0001] The invention belongs to the field of silicon micro-electromechanical manufacturing, in particular to a heating element, a micro-heater and a preparation method thereof. Background technique [0002] With the continuous development of micromachining technology, MEMS (micro-electromechanical systems) devices with different functions have been widely used in various fields. Among them, micro-heaters are used in gas sensors, microcalorimeters, gas flow meters, infrared light sources, etc. have been widely applied. MEMS micro-heaters have the advantages of small heat loss, low power consumption, small size, quick response, mass production, and low price, and are especially suitable for sensing applications in the fields of environmental monitoring, production safety, smart terminals, and wearable products. , is a hot area of ​​product development in recent years. [0003] A lot of research has been carried out on micro-heaters at home and abroad, but the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/14H05B3/06
CPCH05B3/06H05B3/148
Inventor 陈滢李昕欣
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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