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Chip transfer device and chip transfer method

A chip transfer and LED chip technology, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of low yield and inaccurate alignment of multiple transfers, so as to reduce transfer costs and improve transfer. The effect of efficiency

Pending Publication Date: 2021-02-02
INCOFLEX SEMICON TECH CO LTD
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the existing Micro-LED batch transfer technologies include van der Waals force, phase change, electrostatic adsorption, laser ablation, and film transfer methods, but there are many transfers with low yield, inaccurate alignment, or the need for specific intermediate layers or peeling off. layers and other disadvantages

Method used

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  • Chip transfer device and chip transfer method
  • Chip transfer device and chip transfer method
  • Chip transfer device and chip transfer method

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Embodiment Construction

[0035] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0036] Furthermore, the drawings are merely schematic illustrations of embodiments of the disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus repeated descriptions thereof will be omitted. Some of the block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically separate entities.

[0037] In this ex...

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Abstract

The embodiment of the invention relates to a chip transfer device and a chip transfer method. The chip transfer device comprises a first rolling wheel and a second rolling wheel; the surface of the first rolling wheel comprises a plurality of first magnetic adsorption areas which are regularly arranged, so that a plurality of LED chips on an LED array substrate are adsorbed to the corresponding first magnetic adsorption areas respectively; the second rolling wheel and the first rolling wheel are spaced by a preset distance and rotate relatively; the surface of the second rolling wheel comprises a plurality of second magnetic adsorption areas which are arranged regularly, so that the LED chips adsorbed to the first magnetic adsorption areas are adsorbed to the corresponding second magneticadsorption areas respectively; and the second rolling wheel is also used for moving relative to a driving circuit substrate so as to transfer the plurality of LED chips adsorbed by the second rollingwheel to corresponding positions on the driving circuit substrate respectively. According to the embodiment of the invention, on one hand, the transfer efficiency of the LED chips can be improved; andon the other hand, the rolling wheels can be repeatedly used, so that the transfer cost of the LED chips is reduced.

Description

technical field [0001] Embodiments of the present disclosure relate to the field of semiconductor technology, and in particular, to a chip transfer device and a chip transfer method. Background technique [0002] The display principle of Micro-LED (miniature light-emitting diode) is to miniaturize, array, and filmize the traditional LED structure design, and then transfer a large number (usually tens of thousands to hundreds of thousands) of Micro-LED crystals through mass transfer technology. The particles are transferred to the circuit board in batches, and the protective layer is manufactured by physical deposition to complete the packaging, and finally the Micro-LED display with a simple structure is completed. However, how to transfer tens of thousands or even more Micro-LED grains to the circuit substrate is still one of the core technologies that Micro-LED is difficult to solve. [0003] At present, the existing Micro-LED batch transfer technologies include van der W...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L33/62
CPCH01L21/6835H01L33/62H01L2933/0066H01L2221/68368
Inventor 张敏刚李嘉宸甘舟施文杰
Owner INCOFLEX SEMICON TECH CO LTD
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