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Sputtering system

A sputtering and target material technology, applied in the field of sputtering system, can solve problems such as differences in sputtering rate on the surface of objects, uneven coating thickness, and lower overall plating rate

Active Publication Date: 2021-01-29
INTERFACE TECH CHENGDU CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Since when the surface of the object is a curved surface, the distance from each target to the surface of the object may be different, resulting in a difference in the sputtering rate on the surface of the object, resulting in uneven coating thickness
In order to solve the problem of uneven coating thickness, the conventional technology adjusts the coating thickness by setting additional shutters
However, although this method of adding shutters can make the coating on the curved surface more uniform, it will also greatly reduce the overall coating rate

Method used

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Embodiment Construction

[0074] The disclosure is particularly described with the following examples, which are for illustration only, since various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the disclosure, Therefore, the scope of protection of the disclosure should be defined by the appended claims. Throughout the specification and claims, unless the content clearly dictates otherwise, the meaning of "a" and "the" includes such statements including "one or at least one" of the stated element or component. Furthermore, as used in this disclosure, the singular article also includes the description of a plurality of elements or components, unless it is obvious from the specific context that a plurality is excluded. Furthermore, as applied to this description and all claims that follow, the meaning of "in" may include "in" and "on" unless the content clearly dictates otherwise. Terms used throughout the specification and claims, unle...

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Abstract

The invention provides a sputtering system which is suitable for sputtering a surface to be sputtered with a plurality of sections. Each section has a projection height. The sputtering system comprises a support plate, a sputtering array and a controller. The sputtering array is arranged on the supporting plate and comprises a plurality of sputtering units, and each section at least corresponds toone of the sputtering units. Each sputtering coating unit is provided with a driving shaft and a target material. The target material faces the surface to be sputtered. The controller is electricallyconnected with the driving shaft. The driving shaft is linked with the target material and controls the target material to move relative to the surface to be sputtered, and the controller controls the distance from each sputtering unit in the sputtering units to a corresponding section in the sections in the direction of the projection height to meet a preset condition.

Description

technical field [0001] The present invention relates to a sputtering system, and in particular to a sputtering system suitable for sputtering objects with curved surfaces (or three-dimensional surfaces). Background technique [0002] Sputtering technology has been widely used in the semiconductor and optoelectronic industries. When the surface of the object is flat, the distance from each target to the surface of the object is the same, so it is easy to achieve uniform coating thickness. When the surface of the object is a curved surface, the distance from each target to the surface of the object may be different, resulting in a difference in the sputtering rate on the surface of the object, resulting in uneven coating thickness. In order to solve the problem of non-uniform coating thickness, conventional technology adjusts the coating thickness by additionally setting shutters. However, although this additional shielding scheme can make the coating on the curved surface mo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/54C23C14/56
CPCC23C14/3464C23C14/542C23C14/568C23C14/3407H01J37/3435H01J37/3417H01J37/32403H01J37/3429C23C14/042C23C14/54
Inventor 陈伯纶陈俊达周宗震吴景扬薛乃豪
Owner INTERFACE TECH CHENGDU CO LTD
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