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Method for cleaning insides of holes of gas distribution aluminum component in CVD equipment

A technology of gas distribution and cleaning method, which is applied in the direction of gaseous chemical plating, metal material coating process, coating, etc., which can solve the problems of ion residue, shorten the service life of components and the number of regenerations, and reduce the occurrence of patterns on the surface of components , Improve the success rate and quality of cleaning, and improve the effect of cleaning effect

Pending Publication Date: 2021-01-15
安徽富乐德科技发展股份有限公司
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  • Abstract
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Problems solved by technology

[0004] In the conventional cleaning process, chemical solution is used to soak the residue in the hole of the gas diffuser. Although this process can finally achieve the purpose of removing film quality and cleaning surface pollutants, it will bring the risk of ion residue, and the chemical solution The continuous expansion of the pore diameter greatly shortens the service life and regeneration times of the components, so a simple and effective cleaning method is needed to overcome these shortcomings

Method used

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  • Method for cleaning insides of holes of gas distribution aluminum component in CVD equipment
  • Method for cleaning insides of holes of gas distribution aluminum component in CVD equipment

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] see Figure 1-Figure 2 The present invention provides a technical solution: the device includes: a device base 1, a device upper cover 2, a water-air pipeline 3 and a sealing ring 4, and the device base 1 includes a sealing base 11 with 4 water-air holes and a base The support member 12 and the device base 11 are also provided with a sealing O-ring installation groove 111. One end of the water and air pipeline 3 includes a water pipe interface 31 and an...

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Abstract

The invention aims to provide a method for cleaning the insides of holes of a gas distribution aluminum component in CVD equipment. The method specifically includes the following steps that a gas diffuser is put into a sealing jig, water is driven through compressed air after sealing and mounting, and each hole of the gas diffuser is fully flushed, so that the cleaning and regenerating quality ofa product is improved, and the cleaning effect is obvious. The method is applicable to cleaning and regeneration treatment of all CVD gas diffusers, and the cleanliness is improved for the environmentof high-manufacturing-procedure chip using equipment.

Description

technical field [0001] The invention relates to a method for cleaning inside holes of gas distribution aluminum parts in CVD equipment. Background technique [0002] Semiconductor integrated circuit manufacturing technology continues to develop rapidly. "Light, thin, short, and small" has been affecting the continuous refresh of technology. The continuous emergence of new technologies has led to a rapid increase in chip integration. In the domestic market, 28nm, 14nm, and 7nm chip manufacturing The technology is becoming more and more mature, and the 5nm chip technology is also being tested continuously. Chemical vapor deposition, CVD for short, is one of the key processes in the semiconductor manufacturing process. Generally, in the chemical vapor deposition process, in order to improve the uniformity of the deposited film, a gas diffuser is used in the chemical vapor deposition equipment to diffuse the gas evenly, so that the film is evenly deposited on the substrate. In...

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Application Information

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IPC IPC(8): C23C16/44
CPCC23C16/4407
Inventor 王圣福王永东张正伟
Owner 安徽富乐德科技发展股份有限公司
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