Substrate support assembly and substrate processing device including same

A substrate processing device and a technology for supporting components, which are applied in the fields of electrical components, semiconductor/solid-state device manufacturing, coating, etc., can solve problems such as uneven distance and deterioration of processing uniformity during substrate processing, and achieve the effect of improving processing uniformity.

Pending Publication Date: 2021-01-12
エーエスエムアイピーホールディングベーフェー
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the distance between the substrate of the reactor and the gas supplier is not uniform in the reaction space of the reactor, and the processing uniformity of the substrate processing process may deteriorate

Method used

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  • Substrate support assembly and substrate processing device including same
  • Substrate support assembly and substrate processing device including same
  • Substrate support assembly and substrate processing device including same

Examples

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Embodiment Construction

[0037] Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments are merely described below, by referring to the figures, to explain aspects of the present description. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. When an expression such as "at least one" precedes a list of elements, it modifies the entire list of elements and does not modify the individual elements of the list.

[0038] Hereinafter, one or more embodiments will be described more fully with reference to the accompanying drawings.

[0039] In this regard, the present embodiments may have different forms and should not be construed as being...

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Abstract

A substrate support assembly arranged in a chamber includes a support plate including a first surface on which a substrate is seated; a driver configured to tilt the support plate such that the firstsurface is inclined with respect to a reference surface by a lower inclination angle; and a controller configured to control the driver such that the lower inclination angle is adjusted based on an upper inclination angle formed by the inclination of the gas supplier coupled to the upper surface of the chamber with respect to the reference surface.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of U.S. Patent Application No. 62 / 872,551, filed July 10, 2019, the entire disclosure of which is incorporated herein by reference. technical field [0003] One or more embodiments relate to a substrate support assembly and a substrate processing apparatus including the same, and more particularly, to a substrate support assembly capable of forming a uniform distance between a substrate and a gas supplier, and a substrate support assembly including the same. Substrate processing equipment. Background technique [0004] The size of semiconductor devices continues to decrease, and therefore, the importance of precisely controlling the processes performed on substrates, such as deposition, is increasing. The substrate processing process may include a step for maintaining the inside of the reactor of the substrate processing apparatus at vacuum pressure and / or high temperature as necess...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/67
CPCH01L21/67017H01L21/67259H01L21/68764H01L21/68771C23C16/4582C23C16/52H01L21/68785H01L21/68792C23C16/4583H01J37/32715H01L21/6708
Inventor 卢载旻李主日朴健溶
Owner エーエスエムアイピーホールディングベーフェー
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