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Integrated heat dissipation packaging structure based on array micro-spraying structure and manufacturing method thereof

A packaging structure and array technology, applied in the fields of semiconductor/solid-state device manufacturing, electrical solid-state devices, semiconductor devices, etc., can solve the problems of high-power CPU performance degradation, high mechanical structure strength, and reliability degradation, etc., to achieve easy commercialization, The effect of improving mechanical strength and facilitating processing

Pending Publication Date: 2021-01-08
XIAMEN UNIV
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  • Application Information

AI Technical Summary

Problems solved by technology

The cavity structure exposed by the bonding of the target cooling chip and the heat sink of the array micro-spray structure, due to the vertical spray of the cooling medium, there is a stress deformation problem, and the mechanical structure strength is at great risk, which may lead to performance degradation and reliability of high-power CPUs decline

Method used

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  • Integrated heat dissipation packaging structure based on array micro-spraying structure and manufacturing method thereof
  • Integrated heat dissipation packaging structure based on array micro-spraying structure and manufacturing method thereof
  • Integrated heat dissipation packaging structure based on array micro-spraying structure and manufacturing method thereof

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Embodiment Construction

[0033] The present invention will be further explained below in conjunction with the accompanying drawings and specific embodiments. The drawings of the present invention are only schematic diagrams for easier understanding of the present invention, and their specific proportions can be adjusted according to design requirements. Those skilled in the art should understand the upper and lower relationships of relative components and the definition of front / back in the figures described herein refer to the relative positions of the components, so they can be turned over to present the same components, which should all belong to this document. The scope disclosed in the manual.

[0034] An integrated heat dissipation packaging structure based on array micro-spray structure, such as figure 1 As shown, it mainly includes a high-power CPU 000 , an adapter board 130 and a housing 210 . The adapter board 130 is assembled in the housing 210 . The upper surface of the adapter board 130...

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Abstract

The invention discloses an integrated heat dissipation packaging structure based on an array micro-spraying structure, which comprises a CPU, an adapter plate and a shell, and the adapter plate is assembled in the shell, and the CPU is arranged on a packaging area of the adapter plate and is in closed connection with the adapter plate; the adapter plate is provided with a first input micro-channel, a second input micro-channel, a third input micro-channel and an output micro-channel, a plurality of horizontal parallel channels are formed in a packaging area of the adapter plate, the two ends of each horizontal parallel channel are communicated with the first input micro-channel and the output micro-channel respectively, and vertical array nozzles are arranged in the horizontal parallel channels. The vertical array nozzles are communicated with the second input micro-channel and the third input micro-channel in the vertical direction. The invention further discloses a manufacturing method of the packaging structure. The parallel straight-through type channels and the vertical array micro-spraying structure are arranged on the adapter plate at the same time to achieve turbulent flow,the bonding process difficulty of the adapter plate and the CPU is reduced while the heat dissipation capacity is effectively improved, and the mechanical strength of the CPU is improved.

Description

technical field [0001] The invention relates to the field of microelectronic packaging, and more specifically relates to an integrated heat dissipation packaging structure based on an array micro-spray structure and a manufacturing method thereof. Background technique [0002] With the continuous change of the information age, the development of the semiconductor industry has made remarkable progress. Faced with the increasing demand for high performance and high integration, the continuous miniaturization of transistors is accompanied by a sharp increase in heat flux. As the core component of modern computers, high-power CPU has the characteristics of large area and high heat flux density. If the operating temperature of CPU cannot be lowered in time, its performance will drop significantly. The existing cooling methods include air cooling, heat pipe cooling, and integrated water cooling. However, with the development of small-scale integration of high-power CPUs, the ...

Claims

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Application Information

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IPC IPC(8): H01L23/473H01L21/48
CPCH01L23/4735H01L21/4803
Inventor 马盛林练婷婷
Owner XIAMEN UNIV
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