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Copper surface processing device for integrated circuit board processing

An integrated circuit board and processing device technology, which is applied in the secondary processing of printed circuits, printed circuits, and printed circuit manufacturing, etc., can solve the problems of inability to collect dust, inability to adjust the circuit board, and affect the processing environment.

Active Publication Date: 2021-01-01
湖南维胜科技电路板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned device also has the following problems in use: first, it is impossible to flatten the processed circuit board, resulting in a poor processing effect; second, it cannot collect the cleaned dust, which affects the processing environment. Third, the processed circuit board cannot be adjusted

Method used

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  • Copper surface processing device for integrated circuit board processing
  • Copper surface processing device for integrated circuit board processing
  • Copper surface processing device for integrated circuit board processing

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Embodiment Construction

[0029]The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them.

[0030] The components of the embodiments of the invention generally described and shown in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention.

[0031] Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] In the description of the present invention, it should be noted that the ...

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Abstract

The invention discloses a copper surface processing device for integrated circuit board processing, and belongs to the technical field of circuit board processing. The device comprises a supporting seat, a fixed plate, a flattening device, a processing device, a cleaning device, a pollution discharge device, an adjusting device and an unwinding device. The supporting seat is horizontally placed onthe ground, and the fixed plate is vertically arranged at the top of the supporting seat; the flattening device is arranged at the top of the supporting base, the processing device is arranged at thetop of the supporting base, the cleaning device is arranged on the side wall of the fixing plate, the pollution discharging device is arranged on the supporting base, and the adjusting device is arranged on the side wall of the fixing plate. The unwinding device is arranged on the side wall of the fixing plate and located beside the adjusting device. The circuit board is cleaned through the cleaning device, and garbage generated after the circuit board is polished is discharged through the sewage discharging device.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a copper surface processing device for integrated circuit board processing. Background technique [0002] The integrated circuit board is a carrier for carrying integrated circuits, but it is often said that the integrated circuit board also carries the integrated circuit. The integrated circuit board is mainly composed of silica gel, so it is generally green. The integrated circuit board uses semiconductor manufacturing technology. Many transistors, resistors, capacitors and other components are fabricated on a small single crystal silicon wafer, and the components are combined into a complete electronic circuit according to the method of multilayer wiring or tunnel wiring. [0003] For example, the patent with the publication number CN211150524U relates to a copper surface processing device for integrated circuit board processing, including a base and a support...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/26H05K13/00
CPCH05K3/0061H05K3/26H05K13/0061
Inventor 许同
Owner 湖南维胜科技电路板有限公司
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