Tunable VCSEL laser chip and manufacturing method thereof

A laser and chip technology, applied in the direction of lasers, laser components, semiconductor lasers, etc., can solve the problems of slow modulation rate, low integration of chips, devices and modules, and large volume, and achieve wavelength tuning and temperature feedback. Sensitive, functional and process integration, the effect of high integration

Active Publication Date: 2020-12-29
威科赛乐微电子股份有限公司
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, at present, VCSEL lasers based on variable temperature tuning usually use a temperature tuning unit, which is generally a semiconductor cooler (Thermal electric cooler, TEC for short), which has a large volume, low integration of chips, devices and modules, slow modulation rate, and Unable to timely measure and feedback compensation for chip temperature changes during work

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Tunable VCSEL laser chip and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The technical solution will be clearly and completely described below in conjunction with the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "top", "bottom" etc. Orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a tunable VCSEL laser chip and a manufacturing method thereof. The tunable VCSEL laser chip comprises a single crystal substrate, a single crystal substrate front surface unit, a single crystal substrate back surface unit and two electrodes; the single crystal substrate front surface unit grows on the front surface of the single crystal substrate, emits laser and comprisesan epitaxial layer, an N-ohmic contact layer, a P-ohmic contact layer and an optical passivation layer; the single crystal substrate back surface unit is subjected to secondary epitaxial growth on the back surface of the single crystal substrate, tunes the laser wavelength and feeds back the chip temperature, and sequentially comprises an insulating layer and an atomic layer thermopile layer which are subjected to inclined epitaxial growth, the insulating layer has an insulating layer epitaxial inclination angle, and the atomic layer thermopile layer has an atomic layer thermopile layer epitaxial inclination angle; a first inclination angle difference exists between the atomic layer thermopile layer epitaxial inclination angle and the insulating layer epitaxial inclination angle; and thetwo electrodes are distributed on the two sides of the atomic layer thermopile layer along the inclination direction of the atomic layer thermopile layer. According to the tunable VCSEL laser chip andthe manufacturing method thereof, wavelength tuning and temperature feedback functions can be achieved at the same time.

Description

technical field [0001] The invention belongs to the technical field of semiconductor lasers, in particular to a tunable VCSEL laser chip and a manufacturing method thereof. Background technique [0002] The existing technology related to this case is mainly Vertical Cavity Surface Emitting Laser (VCSEL for short) technology. Due to the short cavity length of the VCSEL laser, only a single longitudinal mode can be set in the entire gain region, making continuous wide-range wavelength tuning possible, and the output aperture of the VCSEL is similar to that of a single-mode fiber, and the coupling efficiency with the fiber is higher. Made into a high-density laser array, these advantages make it a research hotspot in the field of international optical communication devices. [0003] However, at present, VCSEL lasers based on variable temperature tuning usually use a temperature tuning unit, which is generally a semiconductor cooler (Thermal electric cooler, TEC for short), whi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/06H01S5/026H01S5/02H01S5/183H01L35/32H01L35/34H10N10/01H10N10/17
CPCH01S5/183H01S5/0207H01S5/0206H01S5/0261H01S5/0612H01S2304/00H10N19/101H10N10/01
Inventor 宋世金汤惠淋朱刘刘留苏小平程勇
Owner 威科赛乐微电子股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products