Stacked packaging piece with ground ring and processing method of stacked packaging piece

Abstract

The invention discloses a stacked packaging piece with a grounding ring and a processing method of the stacked packaging piece, and the stacked packaging piece comprises a packaging piece main body, amounting groove, a sliding groove, a guide groove, a first storage groove, a motor, a gear, a rack, a sliding block, a fixed rod, a hinge ferrule, a connecting plate, the grounding ring, a second storage groove and a rotating shaft, and the inner wall of one side of the packaging piece main body is provided with the mounting groove; the motor is distributed and embedded in the inner wall of the bottom end of the mounting groove, the gear is distributed and mounted on the inner wall of one side of the mounting groove, one end of an output shaft of the motor is fixedly connected to the interiorof the gear, and the rack is connected to the outer wall of one side of the gear in a distributed and engaged mode. The stacked packaging piece adopts a grounding ring mode and reduces grounding wireconnection, thus a chip is convenient to install and fix, the space of the packaging piece is reduced, the grounding ring is convenient to install, the welding operation is reduced, a large amount ofharmful gas is prevented from being generated during welding, the environment is prevented from being polluted, and the safety of the packaging piece is improved.

Description

technical field [0001] The invention belongs to the technical field of package equipment, in particular to a stacked package with a grounding ring and a processing method thereof. Background technique [0002] Since the 1980s, electronic products have developed in the direction of multi-functionality, thinness and shortness, and the requirements for high-speed and high-density packaging technology have been put forward. Therefore, stacked packaging has been developed, and grounding refers to the neutral point of power systems and electrical devices, and electrical equipment. The exposed conductive part of the device and the conductive part outside the device are connected to the earth through a conductor; it can be divided into working ground, lightning protection ground and protective ground, and the ground ring is one of the devices. [0003] However, the existing stacked package is generally connected with a ground wire, so that when the chip is large, it is not convenien...

AI Technical Summary

Problems solved by technology

[0003] However, the existing stacked package is generally connected with a ground wire, so that when the chip is large, it is not convenient to bond the ground wire, and it is easy to expand the range of bonding wires, and when the chip size is small, it is easy to produce a separation area, resulting in a shortage of wiring space. Waste, so when operating, you need to pay attention to the size of the chip and the connection range with the ground wire, which indirectly increases the burden on the staff

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