Pin forming equipment for ceramic capacitor chip

Abstract

The invention discloses pin forming equipment for a ceramic capacitor chip, and the equipment comprises an operation platform, a bearing mechanism, a forming mechanism, a cutting mechanism, and a moving mechanism, the top of the operation platform is provided with the bearing mechanism, and the rear side of the bearing mechanism is sequentially provided with the forming mechanism and the cutting mechanism from left to right. A moving mechanism is arranged on the front side of the bearing mechanism, and the moving mechanism and the cutting mechanism are located on the same side; after the structure is adopted, the pin forming equipment for the ceramic capacitor chip can more conveniently and simply form pins of the ceramic capacitor chip; meanwhile, the pins of the ceramic capacitor chip can be formed into different shapes as required by arranging the multiple sets of placing mechanisms and forming tables; the pin bending length of the ceramic capacitor chip can be changed as required;the processing diversity is increased, and the pin forming processing efficiency of the ceramic capacitor chip is improved.

Description

technical field [0001] The invention relates to the technical field of ceramic capacitor chips, in particular to a lead forming device for ceramic capacitor chips. Background technique [0002] At present, the processing of capacitor pins is generally done manually. The processing of capacitor pins is performed by manual cutting, punching and bending after measuring the length of the pins with a jig. This method not only increases the labor intensity of the operator but also increases the working efficiency. Low, can not meet the requirements of mass production of capacitor molding. [0003] Wherein, the pins of the ceramic capacitor chip are generally bent by stamping, and the pins of the ceramic capacitor chip are bent to 90 degrees after one stamping. However, in the actual stamping and bending process, the pins are easy to rebound when the bending is not in place, and the pins will be broken if the stamping pressure is too high, which greatly affects the forming quality...

AI Technical Summary

Problems solved by technology

However, in the actual stamping and bending process, the pins tend to rebound when the bending is not in place, and the pins will be broken if the stamping pressure is too high, which greatly affects the forming quality of the ceramic capacitor chip pins

In addition, it is not easy to control the position of the punch during the stamping and bending process, and it is easy to press on the main body of the ceramic capacitor chip, which may damage the ceramic capacitor chip, which in turn affects the lead forming quality of the ceramic capacitor chip

In addition, the existing stamping and forming device has a large volume and a single function, which in turn affects the lead forming efficiency of the ceramic capacitor chip

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