Building block type sensor

Abstract

The invention discloses a building block type sensor, and belongs to the technical field of intelligent education kits. The building block type sensor comprises a shell and a sensor body installed inthe shell, wherein the shell comprises a bottom shell and a top cover, a buckling piece is arranged at the bottom of the top cover, a buckling position is arranged at the top of the bottom shell, andthe top cover and the bottom shell are clamped into the buckling position at the top of the bottom shell through the buckling piece at the bottom of the top cover to be detachably connected in a buckled mode; a plurality of evenly-distributed plug pin round holes are formed in the bottom of the bottom shell, cross plug pin holes are formed between the plug pin round holes, the plug pin round holesand the cross plug pin holes extend through hole grooves to be formed in the bottom shell 3, and limiting baffles are arranged at the bottoms of the hole grooves; and a round hole is formed in the top of the top cover, and a probe component of the sensor body works with external induction through the round hole. The building block type sensor has the advantages of being convenient to disassembleand assemble, high in stability, low in cost and convenient to build.

Description

technical field [0001] The invention relates to the technical field of kits for intelligent education, in particular to a building block sensor. Background technique [0002] At this stage, most of the artificial intelligence education kits in primary and secondary schools are assembled by building blocks, and sensors are often used in the application kits of intelligent teaching, and they are extremely important. [0003] However, most of the sensors at this stage have no housing or are inconvenient to assemble, which is extremely inconvenient to use in educational kits, or increases the difficulty of construction. Secondly, if a sensor shell is to be added, the sensor shell needs to be stable, easy to disassemble, and convenient for the contact end of the sensor to work with external induction, which makes it more difficult to install the sensor shell. [0004] In addition, the existing wave sensor lacks protection during assembly and construction. Once the force is too l...

AI Technical Summary

Problems solved by technology

[0003] However, most of the sensors at this stage have no casing or are inconvenient to assemble, which is extremely inconvenient to use in educational kits, or increases the difficulty of construction

Secondly, if you want to add a sensor shell, you need the sensor shell to be stable, easy to disassemble, and convenient for the contact end of the sensor to work with the external induction, which makes it more difficult to install the sensor shell

[0004] In addition, the existing wave sensor lacks protection during assembly and construction. Once the force is too large, the sensor is easy to be inserted too deep, causing damage to the sensor module, and sometimes it is worried that the sensor module will be damaged when the assembly is too small or the insertion is not in place. The installation will be unstable or the signal of the sensor will be affected by the sound, and the installation effect will not be good, or even fail. You have to reinstall it, which is time-consuming and labor-intensive.

[0005] In addition, the structure of the existing sensors is too complicated, cumbersome to assemble, and difficult to build. Not only is it inconvenient to use in intelligent education and teaching, but the cost is too high, and the education cost is relatively large.

The detachable sensor module is disassembled and assembled for a long time, and the interface is easy to loose, resulting in unstable installation of the sensor and poor signal detection effect; there is also a lack of indicator lights or lack of protection for the internal light source, which is prone to light leakage and affects the external detection work

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