Multilayer circuit board preparation method and multilayer circuit board

Abstract

The invention discloses a multilayer circuit board preparation method and a multilayer circuit board, and the method comprises the steps: blanking: providing at least two circuit board units and at least one link plate, and enabling two opposite side surfaces of each circuit board unit to be provided with a first circuit and a second circuit in a one-to-one correspondence manner, wherein each linkplate is provided with a first via hole penetrating through the link plate, and a first conductive material layer is formed in the first via hole; and stacking and lamination: stacking the circuit board units and the link plates sequentially in a staggered mode from top to bottom, performing lamination processing, forming a multilayer circuit board, and connecting second circuits of the circuit board units with first circuits of the adjacent circuit board units through first conductive material layers; According to the preparation method, the circuit board units are prepared in advance, thenthe circuit board units are stacked according to a preset sequence, the link plates are stacked between every two adjacent circuit board units, every two adjacent circuit board units are integrated into a whole through the link plates, and it is guaranteed that the multilayer circuit board can still keep good conduction performance under the condition of external force.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for preparing a multilayer circuit board and the multilayer circuit board. Background technique [0002] Multilayer circuit boards include a plurality of laminated boards. In the prior art, multilayer circuit boards usually have two preparation methods. The first method is to first make the inner layer chip, then press it with the outer layer board, and then complete the outer layer circuit. Production, these materials are pressed together to open holes by mechanical or laser methods, and the conduction layer material (copper / graphite, etc.) is chemically deposited on the hole wall, and then a certain thickness of copper layer is electroplated to achieve layer-by-layer conduction of the plate , the more layers of boards in multi-layer circuit boards, the more times of lamination. Together, the lamination can be completed by laminating once. This method is the direc...

AI Technical Summary

Problems solved by technology

[0004] The first object of the present invention is to provide a method for preparing a multilayer circuit board, which aims to solve the problem that the circuit between adjacent boards is easily detached due to external factors during the use of the multilayer circuit board prepared by the existing preparation method On-state technical issues

Images