Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Array substrate and preparation method thereof, and display device

A technology for array substrates and display areas, which is applied in semiconductor/solid-state device manufacturing, instruments, and fingerprint/palmprint acquisition/arrangement, etc. Image clarity and other issues, to avoid packaging reliability, increase strength, reduce light loss effect

Active Publication Date: 2022-07-19
BOE TECH GRP CO LTD +1
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the display products of the prior art, the distance between the optical fingerprint recognition module and the screen surface is relatively long, and the light propagation path is long, which affects the clarity of the fingerprint image and the accuracy of fingerprint recognition.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Array substrate and preparation method thereof, and display device
  • Array substrate and preparation method thereof, and display device
  • Array substrate and preparation method thereof, and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] In order to make the purposes, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are some, but not all, embodiments of the present application. And the embodiments in this application and the features in the embodiments may be combined with each other without conflict. Based on the described embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0051] Unless otherwise defined, technical or scientific terms used in this application shall have the ordinary meaning as understood by those of ordinary skill in the art to which this application belongs. A...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present application discloses an array substrate, a preparation method thereof, and a display device, which are used to reduce the light propagation path of pattern recognition and improve the accuracy and efficiency of pattern recognition. The array substrate includes: a substrate; the array substrate has: a display area and a peripheral area; the display area includes: a first thin film transistor on the substrate, and a first connection lead electrically connected to the first thin film transistor on the substrate , an encapsulation layer over the first thin film transistor, a photosensitive device over the encapsulation layer, and a second connection lead electrically connected to the photosensitive device over the encapsulation layer; a first connection lead, a second connection lead, and The encapsulation layers all extend to the peripheral area; the peripheral area includes: a blocking wall between the first connection lead and the encapsulation layer; the encapsulation layer covers the blocking wall, and the encapsulation layer has an exposed first The first via hole of the connecting lead, and the second connecting lead are electrically connected to the first connecting lead through the first via hole.

Description

technical field [0001] The present application relates to the field of display technology, and in particular, to an array substrate, a preparation method thereof, and a display device. Background technique [0002] Organic light-emitting display devices not only have diversified application fields, but also some products are gradually developed to be multi-functional, such as display products with fingerprint recognition function. At present, optical fingerprint recognition has become one of the most important means of realizing fingerprint recognition of display products. However, in the display products of the prior art, the distance between the optical fingerprint identification module and the screen surface is relatively long, and the light propagation path is long, which affects the clarity of the fingerprint image and affects the accuracy of fingerprint identification. SUMMARY OF THE INVENTION [0003] Embodiments of the present application provide an array substrat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32H01L21/77G06F3/041G06V40/13
CPCG06F3/0412G06V40/1318H10K59/60H10K59/131H10K59/1201
Inventor 任怀森杨柯侯鹏李岢恒王林林熊登申黄川
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com