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Method for calculating COG hot-pressing process parameters

A hot-pressing process and parameter technology, applied in the field of display screen, can solve problems such as uneven force, increase manufacturing cost, waste materials, etc., to prevent breakage and ensure the quality of crimping.

Inactive Publication Date: 2020-11-20
SHENZHEN JINGHUA DISPLAY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the two ends of the IC are suspended in the air (such as the parts labeled 8 and 9), there are bumps that are crimped on the glass through the ACF during hot pressing, but there are no bumps in the suspended areas at both ends and cannot be crimped on the glass, resulting in weak force on the IC as a whole. Uniform, often breaks at both ends of the IC (the broken position is at the position of label 6 and 7), resulting in unstable products, not only wasting materials, increasing manufacturing costs, but also bringing customer complaints

Method used

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  • Method for calculating COG hot-pressing process parameters
  • Method for calculating COG hot-pressing process parameters
  • Method for calculating COG hot-pressing process parameters

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Embodiment Construction

[0019] The present invention will be described in detail below in conjunction with the accompanying drawings, and the technical solutions in the embodiments of the present invention will be clearly and completely described. Apparently, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be intervening components at the same time. When a component is said to be "set on" another component, it may be set directly on the other comp...

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Abstract

The invention discloses a method for calculating COG hot-pressing process parameters. The method comprises the steps that a COG pressing value expression is constructed according to the IC thickness,the ACF thickness and the glass thickness of a product, a pressing value actually needing to be set by a COG pressing head is calculated according to the expression, and the calculation formula of thepressing value actually needing to be set by the COG pressing head is shown as follows: S = A-(B-(C + D + E)) + F, wherein S is a pressing value actually required to be set by the COG pressing head,A is a Z-axis reference quantity set in the COG pressing head servo system, B is the actual distance between the lower part of the pressing head and the upper part of a back-supporting platform, C isthe total thickness of the IC including Bump, D is the thickness of the glass, E is the ACF thickness obtained according to the specification, and F is an empirical constant. According to the method for calculating COG hot-pressing process parameters, the ACF curing rate reaches the standard after a Bump region is heated and stressed, and empty Bump regions at two ends are not subjected to the pressure action of the pressing head.

Description

technical field [0001] The present application belongs to the technical field of display screens, and in particular relates to a method for calculating COG hot-pressing process parameters. Background technique [0002] It should be noted that the contents recorded in this section do not represent all prior art. [0003] In the LCD module industry, the COG structure is the most widely used structural design. At present, the LCD module is constantly developing in the direction of higher integration, narrower steps, and lower cost. The driver IC is a key display module component. In order to reduce the manufacturing cost of the IC, some ICs adopt a design with both ends floating, such as Figure 1-Figure 3 As shown, the IC bump is evenly distributed on the bonding surface of the IC, and no bump 201 is distributed at both ends. The length of the indenter tooling for conventional COG hot pressing is generally between 50-70mm, and the length of the IC is between 20-35mm. Since th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13
CPCG02F1/1309
Inventor 鲜小聪文继甜李超韩喆徐长远杨征
Owner SHENZHEN JINGHUA DISPLAY
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