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Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package

A resin composition, thermosetting technology, used in metal layered products, manufacturing printed circuit precursors, semiconductor/solid-state device components, etc. Excellent, high elongation, high heat resistance effect

Pending Publication Date: 2020-11-13
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Furthermore, in substrates on which ceramic components are mounted, the difference in thermal expansion coefficient between the ceramic components and the substrate, and the reduction in component connection reliability due to external shocks have also become major problems.

Method used

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  • Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package
  • Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package
  • Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package

Examples

Experimental program
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Effect test

Embodiment

[0186] Hereinafter, although an Example and a comparative example are shown and this invention is concretely demonstrated, this invention is not limited to these.

Synthetic example 1

[0187] [Synthesis example 1] Production of phenolic resin (A-1)

[0188] (Synthesis of phenolic resin (A-1-a))

[0189]In a glass flask with an inner capacity of 2 L equipped with a thermometer, a stirrer and a cooling tube, add 300 g (1.0 mol) of cardanol, 150 g of methanol, and 120 g (2.0 mol) of a 50% aqueous formaldehyde solution, and dissolve a 30% aqueous solution of sodium hydroxide in 2 hours. Drop into this mixture. Then, it heated up to 45 degreeC, and it was made to react for 6 hours. Next, 35% hydrochloric acid was added to the obtained reaction solution to neutralize sodium hydroxide, and then 1,342 g (10 mol) of o-allylphenol was added, and 1.34 g (0.1% by mass relative to o-allylphenol) was added. Oxalic acid made the system acidic, and after heating up to 100°C, the reaction was carried out for 5 hours. After washing the reaction liquid with water, excess o-allylphenol was distilled off to obtain a phenolic resin (A-1-a).

[0190] The obtained phenolic resi...

Synthetic example 2

[0204] [Synthesis example 2] Production of phenolic resin (A-1)

[0205] (Synthesis of phenolic resin (A-1-b))

[0206] 248 g (1.0 mol) of p-(4-pentylcyclohexyl)phenol, 150 g of methanol, and 120 g (2.0 mol) of 50% formaldehyde aqueous solution were added to a glass flask with an inner capacity of 2 L equipped with a thermometer, a stirrer, and a cooling tube, and the mixture was mixed with 2 A 30% aqueous solution of sodium hydroxide was dropped into the mixture after hours. Then, it heated up to 45 degreeC, and it was made to react for 6 hours. Next, after adding 35% hydrochloric acid to the obtained reaction solution to neutralize sodium hydroxide, 1,342 g (10 mol) of o-allylphenol was added, and 1.34 g (0.1% by mass relative to o-allylphenol) was added. Oxalic acid made the system acidic, and after heating up to 100°C, the reaction was carried out for 5 hours. After washing the reaction liquid with water, excess o-allylphenol was distilled off to obtain a phenolic resin...

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Abstract

Provided are: a thermosetting resin composition that makes it possible to form a prepreg that has low elasticity, high heat resistance, high extensibility at both room temperature and high temperatures, highly reliable electrical insulation properties, and excellent cracking resistance and that adheres very strongly to metal foil; a prepreg that contains the thermosetting resin composition; a resin-coated metal foil that is formed by laminating the thermosetting resin composition and a metal foil; a laminate that contains the prepreg or the resin-coated metal foil; a printed wiring board thatcontains the laminate; and a semiconductor package that contains the printed wiring board. The thermosetting resin composition contains a phenol resin (A). Component (A) includes a phenol resin (A-1)that has a C10-25 aliphatic hydrocarbon group.

Description

technical field [0001] The present invention relates to a thermosetting resin composition, a prepreg, a resin-coated metal foil, a laminate, a printed wiring board, and a semiconductor package. Background technique [0002] From the viewpoint of simplification, efficiency, and labor saving, various personal belongings used in daily life are being digitized, and from the viewpoint of convenience in use, electronic components used in electronic equipment are required to be further reduced in weight and miniaturization. Therefore, the printed wiring boards mounted therein are also required to have higher densities and higher functions. [0003] By making the thickness of the glass cloth as the base material thinner (for example, a thickness of 30 μm or less), the density of the printed wiring board can be further appropriately completed, so a glass cloth with such a thinness has been developed and marketed recently. prepregs. Although the densification of printed wiring boar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/08B32B15/08C08J5/24C08L63/00H05K1/03
CPCC08L61/06C08G8/08H05K1/0366C08J5/244C08J2461/06H05K3/022C08J2363/00H01L23/145B32B7/12B32B5/024B32B2457/08B32B2262/106B32B2255/26B32B2307/732B32B2307/51B32B2262/10B32B2262/0269B32B15/14B32B2262/0253B32B5/022B32B2260/046B32B19/041B32B2255/06B32B2264/10B32B19/06B32B2250/40B32B5/26B32B2260/021B32B7/02B32B15/20B32B2250/05B32B2307/206B32B5/08B32B2264/102B32B2262/101B32B2262/14B32B15/043B32B2262/062B32B2307/306C08J5/249B32B15/08C08L63/00H01L23/14H05K1/03C08G8/10C08J5/18B32B15/098B32B2305/076B32B2307/738B32B2363/00H05K1/056
Inventor 平山雄祥串田圭祐富冈健一清水浩
Owner HITACHI CHEM CO LTD
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