Silicon-based micro coaxial delay line chip

A delay line, coaxial technology, applied in the field of radio frequency microwave, can solve the problems of large loss, inability to integrate, large volume, etc., to achieve the effect of solving large loss

Active Publication Date: 2020-11-06
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the embodiment of the present invention provides a silicon-based micro-coaxial delay line chip, which aims to solve the problems of large loss, large temperature drift, large volume and inability to integrate in the existing delay line technology

Method used

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  • Silicon-based micro coaxial delay line chip
  • Silicon-based micro coaxial delay line chip
  • Silicon-based micro coaxial delay line chip

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Embodiment Construction

[0040] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present invention. It will be apparent, however, to one skilled in the art that the invention may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0041] In order to illustrate the technical solutions of the present invention, specific examples are used below to illustrate.

[0042] Figure 1 to Figure 6 For the schematic diagram of the silicon-based micro-coaxial structure provided by the embodiment of the present invention, please refer to Figure 1 to Figure 6 , the silicon-based micro-coaxial delay line chip includes:

[0043] The int...

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Abstract

The invention provides a silicon-based microcoaxial delay line chip. The silicon-based microcoaxial delay line chip comprises a first substrate, a second substrate and a third substrate which are packaged and integrated, wherein the first substrate is provided with a first groove and a first through hole array; the second substrate is provided with an annular silicon wafer, and the annular siliconwafer is provided with a second through hole array; the third substrate is provided with a second groove and a third through hole array; the second groove comprises a switching groove and a third groove; the switching groove is provided with a core leading-out structure; the first substrate, the second substrate and the third substrate are bonded through a metal layer, and the first groove, the annular silicon wafer and the third groove form a cavity surrounding the core silicon wafer; and the cavity is filled with air to form a silicon-based micro coaxial delay line structure. According to the silicon-based microcoaxial delay line chip, the core silicon wafer in the micro-coaxial delay line chip can be changed in structural forms such as turning, winding or stacking, so that the length of the transmission line is controlled, and meanwhile, the delay amount of the chip is adjusted.

Description

technical field [0001] The invention belongs to the field of radio frequency microwave technology, and in particular relates to a silicon-based micro-coaxial delay line chip. Background technique [0002] Delay line chips are widely used in technical fields such as radar and communication. The existing delay line chip has the following defects: [0003] 1) When the delay chip of Monolithic Microwave Integrated Circuit (MMIC) has a large amount of delay, the insertion loss of the delayer also increases, and the temperature drift also increases. [0004] 2) The delay chip of the existing MMIC is large in size and has a single function, which makes it difficult to apply the chip in the system, and it is difficult to optimize the system and component indicators. Among them, the coaxial delay line structure also has problems such as large size and inability to integrate . Contents of the invention [0005] In view of this, the embodiment of the present invention provides a s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P3/00H01L27/02
CPCH01L27/0203H01P3/00
Inventor 李宏军要志宏申晓芳钱丽勋田秀伟杨志董春辉王胜福李丰付兴中周名齐周少波郭磊明宋志刚聂轶
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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