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A kind of metamaterial structure and preparation method thereof

A technology of metamaterials and non-metallic materials, applied in the field of new metamaterials and its preparation, can solve problems such as difficult conformation, easy corrosion, high cost, etc., achieve high ductility and conformality, and reduce preparation costs

Active Publication Date: 2022-05-24
AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is: to overcome the deficiencies of the prior art, to provide a novel metamaterial structure and its preparation method, to solve the high cost, Corrosion-prone and non-conformable technical issues

Method used

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  • A kind of metamaterial structure and preparation method thereof
  • A kind of metamaterial structure and preparation method thereof
  • A kind of metamaterial structure and preparation method thereof

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preparation example Construction

[0041] Specifically, the present invention also proposes a method for preparing a novel metamaterial structure, comprising the following steps:

[0042] Step a, prepare a 20×20cm substrate 1, clean the printing surface of the substrate 1 with acetone or alcohol solvent, and dry it naturally;

[0043] The specific method of pressing the substrate 1 is: placing the flexible substrate 1 on a flat vulcanizing machine, pressing for 15 minutes under the conditions of an upper plate temperature of 100° C., a lower plate temperature of 110° C., and a pressure of 4.0 MPa, with a pressing thickness of 0.2 mm.

[0044] Step b, design the pattern of the periodic slot array unit 3 for printing, and the periodic slot array unit 3 is arranged n in the manner of n×n 2 For example, if the substrate 1 adopts a square size of 20 × 20 cm, and n=15, a total of 225 periodic slot array units are arranged.

[0045] The periodic slot array unit 3 adopts a square slot pattern, the size of which is: th...

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Abstract

A new type of metamaterial structure and its preparation method, including a substrate, a liquid metal film distributed on the surface of the substrate with a periodic slit array and an anti-oxidation insulating film layer for packaging; the preparation method involves: providing a substrate; The printing mechanism of liquid metal ink is printed on the surface of the substrate according to the preset periodic pattern to form a liquid metal film with a periodic slit array; after encapsulating the liquid metal film with a periodic slit array with an insulating film layer, the metamaterial structure is completed preparation. The invention effectively controls the frequency band width and transmittance of incident electromagnetic waves through the parameter design of the size and shape of the liquid metal resonant structure of the periodic slot array, and realizes the stealth effect of high transmittance in the band and suppression out of the band. The invention is used to construct various composite material substrates, especially flexible substrate metamaterial structures, has simple process, convenient operation, can effectively reduce the preparation cost of metamaterial structures, greatly improves production efficiency, and has extremely high application value.

Description

technical field [0001] The invention relates to a novel metamaterial and a preparation method thereof, belongs to the field of microwave technology, and can be used in many fields that have strict requirements on the preparation of metamaterials, such as reflective surface antennas and special-shaped radomes. Background technique [0002] The periodic array unit structure is a special metamaterial structure. The periodic array unit structure can effectively control the transmission and reflection of incident electromagnetic waves, and is a special spatial filter. The radome or radome equipped with a periodic array unit structure can effectively reduce the radar cross section of these components, thereby achieving the purpose of stealth. The stealth of radar antenna system has become the most important and most difficult problem to solve in the stealth design of aircraft and other weapons and equipment. [0003] At present, there are many units in China that are conducting ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q15/00H01Q1/42C09D11/02
CPCH01Q15/0026H01Q1/422C09D11/02
Inventor 孙荣庆孙宝岗杨智勇杨昆晓颜鸿斌左小彪王建昌雷琴史汉桥刘云华
Owner AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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