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Preparation method of copper surface super-roughening surface treating agent suitable for 5G communication

A technology of surface treatment agent and preparation method, which is applied in the field of 5G communication and can solve problems such as rough communication lines

Pending Publication Date: 2020-10-30
深圳市大正瑞地科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the deficiencies of the existing technology, the present invention provides a preparation method suitable for super-roughening surface treatment agent on copper surface of 5G communication, which solves the contradiction between the rough and smooth copper surface of traditional communication lines and 5G signal transmission and signal loss question

Method used

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Examples

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Effect test

Embodiment 1

[0016] A method for preparing a super-roughening surface treatment agent suitable for 5G communication copper surfaces. The super-roughening agent uses a buffer solution formed by an organic acid and its salt solution as a medium, and the buffer solution is formed by neutralizing an organic acid and an alkali, and the organic acid is formic acid , the alkali is sodium hydroxide, the pH of the buffer solution is 2, the solution of the super-roughening agent includes organic copper, formic acid, sodium formate and sodium chloride, and the organic copper is copper formate, copper acetate, copper propionate, and copper lactate. One or more mixtures, the ratio of each component in the super roughening agent is organic copper 20g / L, formic acid 80g / L, sodium formate 15g / L, sodium chloride 15g / L, acrylic acid and methacrylic acid polymer 4g / L, OP emulsifier 0.8g / L and post-treatment agent, after-treatment agent is 8% HCI, all the other components are deionized water, the preparation m...

Embodiment 2

[0019] A method for preparing a super-roughening surface treatment agent suitable for 5G communication copper surfaces. The super-roughening agent uses a buffer solution formed by an organic acid and its salt solution as a medium, and the buffer solution is formed by neutralizing an organic acid and an alkali, and the organic acid is formic acid , the alkali is sodium hydroxide, the pH of the buffer solution is 3, the solution of the super-roughening agent includes organic copper, formic acid, sodium formate and sodium chloride, and the organic copper is copper formate, copper acetate, copper propionate, and copper lactate. One or several mixtures, the ratio of each component in the super roughening agent is organic copper 40g / L, formic acid 90g / L, sodium formate 20g / L, sodium chloride 20g / L, acrylic acid and methacrylic acid polymer 5g / L, OP emulsifier 1g / L and post-treatment agent, the post-treatment agent is 10% HCI, and the remaining components are deionized water. The sol...

Embodiment 3

[0022] A method for preparing a super-roughening surface treatment agent suitable for 5G communication copper surfaces. The super-roughening agent uses a buffer solution formed by an organic acid and its salt solution as a medium, and the buffer solution is formed by neutralizing an organic acid and an alkali, and the organic acid is formic acid , the alkali is sodium hydroxide, the pH of the buffer solution is 4, the solution of the super-roughening agent includes organic copper, formic acid, sodium formate and sodium chloride, and the organic copper is copper formate, copper acetate, copper propionate and copper lactate. One or more mixtures, the ratio of each component in the super roughening agent is organic copper 60g / L, formic acid 100g / L, sodium formate 25g / L, sodium chloride 25g / L, acrylic acid and methacrylic acid polymer 6g / L, OP emulsifier 1.2g / L and aftertreatment agent, aftertreatment agent is the HCI of 12%, all the other components are deionized water, the prepar...

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Abstract

The invention discloses a preparation method of a copper surface super-roughening surface treating agent suitable for 5G communication, and relates to the technical field of 5G communication. The super-roughening agent takes a buffer solution formed by an organic acid and a salt solution thereof as a medium, the pH value of the buffer solution is 2-4, and the solution of the super-roughening agentcomprises organic copper, formic acid, sodium formate and sodium chloride. According to the preparation method of the copper surface super-roughening surface treating agent suitable for the 5G communication, a mode that the copper surface is firstly covered with a polymeric membrane with a net-shaped structure and a selective inward drilling is carried out is adopted, so that an in-copper-surfaceroughening structure is formed, the microscopic surface area after roughening is increased, the binding force with an insulating layer covered with the copper surface in a post-processing procedure is improved, then the polymeric membrane is stripped by using a post-treatment agent, and meanwhile, the roughened copper tip is cut by using the function of the post-treatment agent for reversely etching copper, so that the copper at the tip is greatly reduced, the discharge of the copper tip is reduced, and the loss of signals is reduced.

Description

technical field [0001] The invention relates to the technical field of 5G communication, in particular to a preparation method of an ultra-roughening surface treatment agent suitable for 5G communication copper surface. Background technique [0002] 5G communication requires extremely thin lines, fast transmission speed on the copper surface, and low signal loss. Then, the copper surface must have excellent bonding force with the insulating layer on the copper surface, but achieving the above two points is a very contradictory problem. a. Theoretically, transmission means less signal loss, and the copper surface naturally needs to be smooth, which is conducive to the transmission of electronic signals. The smooth surface reduces tip discharge and signal loss. b. The smooth surface has a bonding force for the copper covering the insulating layer. Unfavorable problem, in order to improve the bonding force, the copper surface needs to be roughened. In order to solve the contra...

Claims

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Application Information

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IPC IPC(8): C23F1/18
CPCC23F1/18
Inventor 林小华
Owner 深圳市大正瑞地科技有限公司
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