Semiconductor refrigeration module, space air-cooling heat dissipation device and space equipment

Abstract

The invention discloses a semiconductor refrigeration module, a space air-cooling heat dissipation device and space equipment, and relates to the field of aerospace. The semiconductor refrigeration module comprises a cold plate, a semiconductor refrigerator and an air cooling heat exchanger, the hot end of the semiconductor refrigerator makes contact with the cold plate, and the cold plate communicates with a liquid loop and is used for enabling liquid in the liquid loop to exchange heat with the hot end of the semiconductor refrigerator; the cold end of the semiconductor refrigerator makes contact with the air cooling heat exchanger, and the air cooling heat exchanger communicates with a gas loop and is used for enabling gas in the gas loop to exchange heat with the cold end of the semiconductor refrigerator. Stable and safe refrigeration can be achieved in the space environment, and due to the fact that semiconductor refrigeration has the advantages of being simple in structure, small in size, light in weight, short in response time and high in controllability and the thermal control temperature range is large, the practicability is higher, and the refrigeration requirement in the space environment can be met.

Description

technical field [0001] The invention relates to the field of aerospace, in particular to a semiconductor refrigeration module, a space air-cooled heat dissipation device and space equipment. Background technique [0002] At present, for ground cooling requirements, relatively mature vapor compression refrigeration systems are usually used, such as image 3 As shown, the low-pressure and low-temperature refrigerant vapor flowing from the evaporator is sucked by the refrigeration compressor, compressed into high-pressure and high-temperature vapor by the compressor and discharged, and the heat is released in the condenser and transferred to the surrounding medium, thereby The refrigerant vapor is gradually condensed into a liquid, and the refrigerant liquid from the condenser is decompressed to the evaporation pressure through the expansion valve, and continues to circulate in the evaporator. [0003] However, for the space environment, the traditional ground cooling scheme is...

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Problems solved by technology

[0003] However, for space environments, traditional ground cooling solutions are no longer applicable

The main reasons are as follows: 1. Under the condition of constant gravity, the gravity makes the lubricating oil flow into the oil tank of the compressor, but in the microgravity environment, if a large amount of lubricating oil leaves the oil pool and enters the cylinder, the compressor will not be able to lubricate. It will lead to the increase of leakage and friction, which will cause problems such as high power consumption and shortened life of the compressor; 2. Under the condition of constant gravity on the ground, due to the difference in density between the gas and liquid phases, the gas-liquid mixture will naturally stratify

Under microgravity conditions, it must be realized by gas-liquid separation technology. At present, gas-liquid separation can only achieve the separation of no visible droplets in the gas, and the inflow of liquid will damage the compressor; 3. The evaporator and condenser are the two components of vapor compression refrigeration. Key components, under microgravity conditions, due to the formation of air bubbles and liquid films that cannot leave the wall in time, the heat transfer of the heat exchanger will deteriorate

[0004] At present, the International Space Station uses a liquid cooling circuit for refrigeration to solve the above problems, such as Figure 4 As shown, the liquid is cooled by an external cold source, driven into the gas-liquid heat exchanger through the circulation pump, and the high-temperature gas and low-temperature liquid are exchanged through the gas-liquid heat exchanger, and the high-temperature gas is cooled. However, the cycle of the load side The minimum inlet gas temperature is restricted by the coolant temperature on the cold side of the gas-liquid heat exchanger, and the thermal control temperature range is small

In the limit state, the minimum inlet temperature of the heat load is equal to the temperature of the inlet working medium on the liquid side of the liquid cooling circuit, so it is difficult to meet the actual demand

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