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A method and system for extracting ibis model of integrated circuit based on equivalent circuit model

An equivalent circuit model, integrated circuit technology, applied in electrical digital data processing, instrumentation, calculation, etc., can solve the problems of low efficiency, unprocessed fragmentation, wide and fixed extraction parameters, and achieve high extraction integrity and accurate simulation. High performance and high extraction efficiency

Active Publication Date: 2020-11-24
北京智芯仿真科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the IBIS model extraction of integrated circuits has the following problems: 1. The IBIS model extraction parameters of IC packaging network are broad and fixed
3. The accuracy, completeness and efficiency of the field identification and grid subdivision processing of the integrated circuit layout in the existing technology cannot be guaranteed, and the accuracy and efficiency of the processing results are low
4. The alignment and simplification of multiple polygons in the layout of multi-layer integrated circuits in the prior art is only simplified for single-layer polygons, and the problem of fragmentation after multi-layer polygons form a parallel flat field is not dealt with, and only for a single polygon When simplifying, the overlap of polygons on both sides of the gap is not considered

Method used

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  • A method and system for extracting ibis model of integrated circuit based on equivalent circuit model
  • A method and system for extracting ibis model of integrated circuit based on equivalent circuit model
  • A method and system for extracting ibis model of integrated circuit based on equivalent circuit model

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Embodiment 1

[0058] refer to figure 1 and figure 2 , a method for extracting an integrated circuit IBIS model based on an equivalent circuit model, comprising steps:

[0059] S1: Obtain the layout information of the multilayer integrated circuit of the passive part of the integrated circuit, and set the relevant parameters and simulation parameters for IBIS model extraction. Specifically, the multilayer integrated circuit layout information includes layer information of the integrated circuit layout, layout shape information, and interconnection information between layers and layouts, wherein the layer information refers to how many layers the multilayer integrated circuit layout includes, and each layer The name and function of each layer, as well as the positional relationship between layers; layout shape information refers to the shape information of each layer in the multilayer integrated circuit layout, and the layout shape corresponding to each functional network, such as the power...

Embodiment 2

[0103] refer to Figure 8 , an integrated circuit IBIS model extraction system based on an equivalent circuit model, the system includes:

[0104] The obtaining module is used to obtain the layout information of the multilayer integrated circuit of the passive part of the integrated circuit and obtain the SPICE model of the active device. Specifically, the multilayer integrated circuit layout information includes layer information of the integrated circuit layout, layout shape information, and interconnection information between layers and layouts, wherein the layer information refers to how many layers the multilayer integrated circuit layout includes, and each layer The name and function of each layer, as well as the positional relationship between layers; layout shape information refers to the shape information of each layer in the multilayer integrated circuit layout, and the layout shape corresponding to each functional network, such as the power network in the multilayer...

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Abstract

The invention provides an integrated circuit IBIS model extraction method and system based on an equivalent circuit model, and the method comprises the steps: obtaining multilayer integrated circuit layout information of a passive part of an integrated circuit, and setting extraction related parameters and simulation parameters; identifying a parallel plate field domain formed by a metal layer-medium of the passive part of the multi-layer integrated circuit, performing mesh generation, and calculating an electromagnetic field; defining a multiport network of the passive part, calculating scattering parameters of the multiport network of the passive part according to multiports of the passive part and the electromagnetic field of the multilayer integrated circuit, and converting the scattering parameters into an SPICE model of the passive part; if the model is the active model, combining the SPICE model of the active part and the passive SPICE model into a new SPICE model through coupling nodes; and converting the SPICE model into an IBIS model. The IBIS model extraction related parameters and simulation parameters of the IC packaging network can be set according to different requirements of users, and the method has the advantages of being high in IBIS model extraction integrity, high in extraction efficiency, high in simulation accuracy and the like.

Description

technical field [0001] The invention relates to the technical field of integrated circuit IBIS model extraction, in particular to an integrated circuit IBIS model extraction method and system based on an equivalent circuit model. Background technique [0002] The equivalent circuit refers to replacing a relatively complex structure in the circuit with a simple structure at the port formed by the coupled node. The replaced circuit maintains the same effect on the external circuit as the original complex structure viewed from the port. For example, if the volt-ampere relationship of the two two-terminal networks is exactly the same, then the circuits corresponding to the two networks are equivalent. Two equivalent networks can have completely different structures internally, but have exactly the same response to the external circuit. [0003] The IBIS (Input / Output Buffer Information Specification) model is a fast and accurate modeling method for input / output (I / O: Input / Outp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/367G06F30/392G06F30/398
CPCG06F30/367G06F30/392G06F30/398
Inventor 唐章宏邹军汲亚飞黄承清王芬
Owner 北京智芯仿真科技有限公司
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