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Electronic component

An electronic device and device technology, applied in the field of electronic devices, can solve the problems of unusable power modules, reduce strength, etc., and achieve the effect of good adaptation and good thermal conductivity

Pending Publication Date: 2020-09-11
EPCOS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the reduced strength (less than 200 MPa), this technology can only be used to a limited extent for MEMS applications (MEMS: "microelectromechanical system", microelectromechanical systems) and not for power modules with high thermomechanical load profiles

Method used

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Embodiment Construction

[0055] In the exemplary embodiments and figures, identical, similar or identically acting elements can each be provided with the same reference symbols. The illustrated elements and their dimensional relationships to one another should not be considered to scale, but rather various elements, such as layers, components, devices and regions, may be shown exaggeratedly for better representation and / or to facilitate better representation. understand well.

[0056] exist figure 1 An embodiment for an electronic device 100 is shown in .

[0057] The electronic component 100 has a first and a second carrier 1, 1' in the form of a heat-conducting substrate, each having a ceramic part with a heat-conducting ceramic material, for example AlN, in particular multilayer AlN, BN, Al 2 o 3 , SiC, SiN, ZnO and / or BeO. The carrier 1 , 1 ′ has a metal layer 6 on the upper side of the ceramic part, for example a material selected from the group consisting of Cu, Ag, W, Mo, Ti, Au, Ni, Zn and...

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PUM

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Abstract

The invention relates to an electronic component comprising at least one first substrate and at least one semiconductor chip.

Description

technical field [0001] Describes an electronic device. For example, the electronic component can be configured as a power module with an integrated functional structure. Background technique [0002] Attempts exist to produce electronic components, in particular power modules, so-called “system power packages”, which, when miniaturized, have a higher power density and a higher mechanical and especially thermomechanical load. In this case, the trend is, for example in the case of applications with power semiconductors and LEDs (LED: “light-emitting diodes”), towards higher operating temperatures, ie from approximately 125° C. to 175° C. or higher. [0003] Glass- and / or epoxy-based lamination technology for the manufacture of so-called power PCBs (PCB: "printed circuit board", printed circuit board) allows the integration of heat-conducting structures as well as the absence of source and active components. However, a limitation lies, for example, in the lack of realizabil...

Claims

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Application Information

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IPC IPC(8): H01L23/538
CPCH01L23/15H01L23/367H01L23/49822H01L23/49833H01L23/5389H01L25/072H01L2224/16227H01L2924/15192H01L2924/15153H01L2924/19105H01L23/36H01L23/53233H01L23/53247
Inventor T·法伊希廷格J·皮希勒N·赖默M·卡伊尼M·施魏因茨格
Owner EPCOS AG
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