High-heat-conduction air cooling rack of electronic equipment

Abstract

The invention discloses a high-heat-conduction air cooling rack for electronic equipment, wherein the high-thermal-conductivity air cooling rack is mainly used for aviation and communication electronic equipment. According to the technical scheme, movable air cooling partition plates connected up and down at interval layer are arranged in the middle of a module bearing area in a heat conduction air cooling rack; each module bearing area is internally provided with a high heat consumption module and a common air cooling module which are arranged in rack guide rail grooves through wedge-shaped locking strips; the side face of the whole high heat consumption module is attached to the outer surface of the left side of a flow guide plate through the pressure of the wedge-shaped locking strip, the generated heat is conducted to the movable air cooling partition plate through the surface of the module body, and cold air is taken away through an air duct; a working fluid generated by air cooler assemblies on the two sides of the box body of the rack enters each module bearing area from the movable air cooling partition plates in opposite directions to establish a smooth air duct, cold airenters from the middle of the movable air cooling partition plate, air flow is conducted in the air ducts, and air closed circulation is conducted in the air ducts of the rack air cooling partition plate, so that heat of the high heat consumption module and / or the air cooling module is taken away.

Description

technical field [0001] The invention relates to a high heat conduction air-cooled rack mainly used for aviation and communication electronic equipment. Background technique [0002] Electronic equipment usually requires high reliability, and excellent heat dissipation is an important guarantee for the reliable operation of electronic equipment. In electronic equipment, the main heat generation is generated by high-power devices, so the heat dissipation of high-power devices is the key to the heat dissipation of the entire electronic equipment. Due to the widespread use of multi-layer circuit boards and high-density surface mount components in electronic equipment, electronic components and equipment will dissipate a lot of heat during operation, and the heat flux will increase. In order to ensure the reliability of components and communication equipment, it is necessary Proper thermal design of electronic equipment. The electronic equipment that realizes system functions m...

AI Technical Summary

Problems solved by technology

[0006] The above methods all have great limitations, and they are all solved at the cost of increasing volume and weight. They often cannot meet the extremely strict space and weight requirements on the aircraft, which greatly limits the scope of use of air-cooled racks.

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