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Release layer structure and method for preparing display panel

A technology for display panels and release layers, applied in final product manufacturing, sustainable manufacturing/processing, identification devices, etc., can solve problems such as difficult maintenance, damage to electronic or optical devices, lower product yield and optical performance, etc., to achieve Improve yield and productivity, avoid adhesion damage, and reduce stripping costs

Active Publication Date: 2022-05-17
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Laser lift-off technology not only has high equipment cost and is not easy to maintain, but also the laser irradiation process may damage electronic or optical devices on flexible substrates, reducing product yield and optical performance

Method used

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  • Release layer structure and method for preparing display panel
  • Release layer structure and method for preparing display panel
  • Release layer structure and method for preparing display panel

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Embodiment Construction

[0037] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0038] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "thickness", "upper", "lower", "left", "right" etc. are based on the attached The orientation or positional relationship sh...

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Abstract

The application discloses a release layer structure, a substrate structure, and a method for preparing a display panel. The release layer structure includes: a thermal induction layer, which is detachably in contact with a partial surface of the display substrate; and a heat conduction layer, which is arranged on the display panel. between the thermal induction layer and the base substrate, so as to provide thermal energy to a partial surface of the display substrate via the thermal induction layer. The release layer structure, the substrate structure and the preparation method of the display panel provided by the present invention set a heat conduction layer and a thermal induction layer between the display substrate and the base substrate, so that different positions of the display substrate are heated unevenly during peeling, reducing the The peeling force between the display substrate and the thermal induction layer can be used to separate the display substrate and the base substrate quickly and without damage, and the peeling cost is low.

Description

technical field [0001] The invention relates to the technical field of flexible display, and more specifically, to a release layer structure and a method for preparing a display panel. Background technique [0002] Flexible display devices usually use flexible substrates to carry devices such as thin film transistors and organic light-emitting diodes (Organic Light-Emitting Diode, OLED for short). Therefore, flexible display devices can be bent, which has huge potential advantages in the display market. [0003] In the traditional manufacturing method of flexible display devices, flexible substrate materials are usually coated on a rigid substrate to form a flexible substrate, and then electronic or optical devices are fabricated on the flexible substrate, and then peeled off by laser irradiation , that is, a high-intensity laser is applied at the interface between the flexible substrate and the rigid substrate (such as glass) to separate the flexible substrate from the rigi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09F9/30
CPCG09F9/301Y02E10/549Y02P70/50
Inventor 远新新张振宇李俊峰顾维杰
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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