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Solid-state immersed liquid cooling server and solid-state immersed liquid cooling service system

An immersion and server technology, applied in the server field, can solve problems such as high noise, low server heat dissipation efficiency, and component corrosion, and achieve the effects of reducing energy loss, improving space utilization, and extending service life

Active Publication Date: 2020-08-07
捷通智慧科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a solid-state immersion liquid-cooled server and a solid-state immersion liquid-cooled service system to solve the problems of low heat dissipation efficiency, high noise and risk of component corrosion in existing servers

Method used

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  • Solid-state immersed liquid cooling server and solid-state immersed liquid cooling service system

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Embodiment

[0038] refer to figure 1 with figure 2 , the internal structure of the server mainly includes: a main board 11, a power supply 12 and a plurality of solid parts 13 arranged at intervals, the main board 11 is provided with a CPU 111 and a plurality of expandable card slots 112 arranged at intervals, refer to image 3 , a solid-state submerged liquid-cooled server 1 is provided with a detachable heat exchange fin assembly 14 on a power supply 12 , a solid component 13 , a CPU 111 and an expandable card slot 112 .

[0039] refer to Figure 3-Figure 6 , the heat exchange fin assembly 14 includes: a first heat conduction fin 141 and a second heat conduction fin 142 arranged at intervals up and down, and a plurality of double-passage capillary tubes 143 arranged between the first heat conduction fin 141 and the second heat conduction fin 142, the first The two heat conducting sheets 142 are respectively arranged on the tops of the solid component 13 , the CPU 111 and the expandab...

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Abstract

The invention discloses a solid immersed liquid cooling server and a liquid cooling service system. The solid-state immersed liquid cooling server comprises a mainboard, a power supply and a pluralityof solid-state components arranged at intervals, wherein the mainboard is provided with a CPU and a plurality of expandable card slots which are arranged at intervals. The power supply, the solid-state component, the CPU and the extensible card slot are respectively provided with a detachable heat exchange sheet assembly. The solid immersed liquid cooling service system employs the solid immersedliquid cooling server; the system comprises a cabinet and a plurality of solid immersed liquid cooling servers arranged in the cabinet in parallel, wherein a cabinet cooling liquid distributor and acabinet cooling liquid collector are respectively arranged on the cabinet; the server cooling liquid distributor is connected with the cabinet cooling liquid distributor, the server cooling liquid collector is connected with the cabinet cooling liquid collector, and the solid-state immersed liquid cooling server and the solid-state immersed liquid cooling service system solve the problems that anexisting server is low in heat dissipation efficiency and large in noise and has component corrosion risks.

Description

technical field [0001] The invention relates to the technical field of servers, in particular to a solid immersion liquid cooling server and a solid immersion liquid cooling service system. Background technique [0002] With the vigorous development of the data center industry in the world and the rapid growth of the social economy, the development and construction of the data center will be in a high-speed period. At the same time, the energy consumption of the data center is also increasing, and the energy consumption ratio of IT equipment ranks first. . [0003] With the development of big data and artificial intelligence, its requirements for servers are getting higher and higher, and the integration and processing capabilities of servers are increasing day by day, so that servers usually generate more heat when they are running. The method is air-cooled, that is, under the action of the fan, the heat-generating components (main board, power supply, etc.) inside the ser...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/183G06F1/20G06F2200/201Y02D10/00
Inventor 肖峰安册册
Owner 捷通智慧科技股份有限公司
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