Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Water-cooling semiconductor temperature-regulating system and method

A technology of temperature adjustment system and semiconductor, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, refrigerators, etc., which can solve the problems of poor comfort experience, hard materials, poor profiling ability, etc., and achieve uniform temperature regulation , uniform structure distribution, strong comfort effect

Pending Publication Date: 2020-07-17
广东彩果科技有限公司
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the traditional technology, the temperature exchange device in the semiconductor temperature control system usually adopts a serpentine pipe formed by S-shaped metal sheet. However, the temperature exchange device made of heat-conducting metal has poor profiling ability and the material is relatively hard. , poor comfort experience

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Water-cooling semiconductor temperature-regulating system and method
  • Water-cooling semiconductor temperature-regulating system and method
  • Water-cooling semiconductor temperature-regulating system and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the application are given in the drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this application more thorough and comprehensive.

[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application.

[0055] It can be understood that the terms "first", "second" and the like used in this application may be...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a water-cooling semiconductor temperature-regulating system. The water-cooling semiconductor temperature-regulating system comprises a control end and a working end, wherein the control end comprises a thermoelectric semiconductor, a water pipe part and a water pump, the water pipe part is connected with the thermoelectric semiconductor, and the water pump is arranged on the water pipe part; the working end comprises a temperature-regulating product and a flexible energy exchanging pipe network, the flexible energy exchanging pipe network is in touch with and fits thewater pipe member, the flexible energy exchanging pipe network is connected with the water pipe part of the control end, the flexible energy exchanging pipe network and the water pipe part form a water circulation loop, and liquid is arranged in the water circulation loop; the flexible energy exchanging pipe network comprises an outer water pipe which is of an annular structure, an inner water pipe which is of a mesh array structure, a water inlet and a water outlet, wherein the inner water pipe is connected with an annular structural inner ring of the outer water pipe and communicates with the outer water pipe; the water inlet is formed in the outer water pipe or the inner water pipe, and the water inlet is connected with the water pipe part of the control end; and the water outlet is located on the outer water pipe or the inner water pipe, and is connected with the water pipe part of the control end. The water-cooling semiconductor temperature-regulating system has the advantage thatmore uniform and comfortable temperature regulation is provided.

Description

technical field [0001] The present application relates to the technical field of semiconductor temperature regulation, in particular to a water-cooled semiconductor temperature regulation system and method. Background technique [0002] With the development of thermoelectric system technology, coupled with the rise of smart home and electronic products and Internet of Things technology, people's acceptance of intelligent equipment combined with thermoelectric cooling or thermoelectric heating functions is also increasing. Even people have put forward more functional requirements for these intelligent daily objects. With the continuous development of electronic devices and the pursuit of high-quality life, thermoelectric refrigeration has become more and more widely used in various fields of production and life due to its advantages of small size, light weight, accurate temperature control and rapid cooling. Such as thermoelectric refrigerators, water dispensers, cups, and s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/04F25B49/00H01L23/38H01L23/473
CPCF25B21/04F25B49/00F25B2321/021F25B2321/0212H01L23/38H01L23/473
Inventor 刘建华
Owner 广东彩果科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products