Foam board cutting device capable of removing adhesion objects

Abstract

The invention relates to the technical field of foam processing, and discloses a foam board cutting device capable of removing adhesion objects. The foam board cutting device comprises a bottom plate,the top of the bottom plate is fixedly connected with a horizontal hydraulic cylinder, the right side of the horizontal hydraulic cylinder is fixedly connected with a water outlet valve, the right side of a buffer spring is fixedly connected with a vertical hydraulic cylinder, a horizontal supporting plate is arranged at the bottom of the bottom plate, the top of the horizontal supporting plate is fixedly connected with a water tank, an electric heating knife belt is arranged at the top of the water tank, the interior of the electric heating knife belt is in rolling connection with a belt pulley, the interior of the belt pulley is fixedly connected with a power wheel through a connecting rod, and a supporting wheel is arranged in the power wheel. According to the foam board cutting devicecapable of removing the adhesion objects, through matched use of the horizontal hydraulic cylinder and the vertical hydraulic cylinder, by combining with matched use of the buffer spring and a resetspring, the effect of removing the adhesion objects on an electric heating cutting mechanism is achieved.

Description

technical field [0001] The invention relates to the technical field of foam processing, in particular to a foam board cutting device capable of removing adhesions. Background technique [0002] Foam plastic is a kind of polymer material formed by a large number of gas micropores dispersed in solid plastic. It has the characteristics of light weight, heat insulation, sound absorption, shock absorption, etc., and its dielectric properties are better than that of matrix resin. It has a wide range of uses, so Almost all kinds of plastics can be made into foamed plastics, and foam molding has become an important field in plastics processing. [0003] The size of the foam board after processing is different, so it is necessary to cut the foam board. Traditional equipment usually uses heating wire to cut, but when the heating wire cuts the foam, the foam will stick after being melted by the heating wire. If it is connected to the heating wire, the cutting efficiency is reduced. In...

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a foam board cutting device that can remove adhesions, which has the advantages of being able to remove adhesions on the electrothermal cutting mechanism, and the incision is smooth, and solves the problem that traditional devices cannot remove the adhesions of electrothermal cutting. Adhesions on the mechanism, the problem that the incision is not smooth

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