Silicon wafer texturing method

Abstract

The invention discloses a silicon wafer texturing method which comprises the following steps: S1, carrying out pre-oxidation treatment on a silicon wafer to be treated to remove pollutants on the surface of the silicon wafer; S2, putting the silicon wafer obtained in the step S1 into pure water for cleaning; S3, putting the silicon wafer obtained in the S2 into an SDE groove for SDE treatment; S4,performing surface oxidation treatment on the silicon wafer obtained in S3; S5, putting the silicon wafer obtained in the step S4 into pure water for cleaning; S6, putting the silicon wafer obtainedin S5 into a TEX groove for texturing treatment; S7, putting the silicon wafer obtained in S6 into pure water for cleaning; S8, performing post-cleaning 1 on the silicon wafer obtained in the S7; S9,putting the silicon wafer obtained in the step S8 into pure water for cleaning, and then performing CP; S10, cleaning the silicon wafer obtained in the step S9 with purified water, and then carrying out post-cleaning 2; S11, cleaning the silicon wafer obtained in the step S10 with purified water, and then cleaning the silicon wafer with hydrofluoric acid; and S12, cleaning the silicon wafer obtained in the step S11 with purified water, and then drying the silicon wafer. The method is suitable for cleaning and texturing the surface of a heterojunction battery.

Description

technical field [0001] The battery preparation process of the present invention specifically relates to a silicon wafer texturing method. Background technique [0002] SHJ (Silicon Herterojunction) silicon heterojunction battery, also known as HIT (Heterojunctionwith intrinsic thin layer) battery, this battery has the characteristics of high efficiency, high Voc, etc., the battery is generally based on N-type silicon wafers, and the silicon substrate interface The requirements are particularly strict (sensitive to surface cleanliness after texturing), and the general process steps are: texturing, amorphous silicon, TCO, screen & testing. [0003] At present, in the large-scale production of SHJ, the texturing process of silicon substrates generally adopts the process of pre-cleaning → damage removal → texturing → post-cleaning → CP (chemical polishing) → HF cleaning → drying, and in the texturing process Among them, the added texturing additives are usually divided into hyd...

AI Technical Summary

Problems solved by technology

However, before going to the HF tank, the surface of the silicon wafer is not completely oxidized, and the ability of the HF tank to remove ions and particles is not fully reflected. On the other hand, in the mass production process, there may still be organic residues on the surface of the silicon wafer after CP. Impact on subsequent amorphous silicon deposition

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