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Double-layer circuit and manufacturing method thereof

A manufacturing method and circuit technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of low production efficiency of liquid metal double-layer circuits

Active Publication Date: 2020-07-07
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, an object of the present invention is to propose a method for making a liquid metal double-layer circuit, to solve the problem of low production efficiency of the liquid metal double-layer circuit in the prior art

Method used

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  • Double-layer circuit and manufacturing method thereof

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Embodiment approach 1

[0042] Step a, select PET film as the base material, the thickness of the base material is 200 μm;

[0043] Step b, drilling required via holes on the base material;

[0044] Step c, performing surface treatment on the base material, cleaning both sides of the base material and the inner wall of the via hole;

[0045] Step d, immersing the base material in the polyurethane colloid for 15 seconds, drying and curing after taking it out, forming a surface modification layer of 50 μm on the surface of the base material;

[0046] Step e, forming a solder resist layer on the surface modification layer on both sides of the base material by laser printing toner; wherein, the solder resist layer includes a silk screen layer of the circuit;

[0047] Step f, put the substrate into the liquid metal coating device and use the roller set to coat the liquid metal on both sides of the substrate; wherein, the liquid metal on the inner wall of the via hole is squeezed into the via hole by the ...

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Abstract

The invention provides a double-layer circuit and a manufacturing method thereof, and relates to the technical field of printed electronic manufacturing. The manufacturing method comprises the following steps: S1, selecting a base material; S2, forming a via hole penetrating the base material; S3, forming surface modification layers adhered with liquid metal on the two surfaces of the base material and the inner walls of the via holes; S4, forming liquid metal non-adhesive patterns on the surface modification layers on the two surfaces of the base material by using a liquid metal non-adhesivematerial; and S5, coating the area, which is not shielded by the pattern not adhered with the liquid metal, of the surface modification layer with the liquid metal to form a liquid metal double-layercircuit. According to the liquid metal double-layer circuit, direct coating of the liquid metal on the two sides of the base material can be achieved through the coating adhering to or not adhering tothe liquid metal, so that compared with direct writing printing, the liquid metal double-layer circuit is high in manufacturing efficiency, simple in manufacturing process and convenient to industrially manufacture in batches.

Description

technical field [0001] The invention belongs to the technical field of printed electronics manufacturing, and in particular relates to a double-layer circuit and a manufacturing method thereof. Background technique [0002] With the continuous advancement of printed electronics technology, conductive fluids represented by liquid metals have made direct writing, printing and other circuit direct printing technologies possible. In the existing liquid metal direct writing and printing, the liquid metal ink infiltrates and adheres to the surface of the organic polymer substrate to realize the single-layer printing of the conductive circuit. [0003] However, for the production of double-layer circuits, the above-mentioned method needs to flip the single-layer liquid metal circuit, and then form a single-layer liquid metal circuit on the other side of the substrate, and then realize the double-layer circuit through drilling and via repairing processes. The production of the circ...

Claims

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Application Information

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IPC IPC(8): H05K3/12H05K3/00H05K3/46H05K1/09
CPCH05K1/09H05K3/0091H05K3/1208H05K3/125H05K3/1275H05K3/46
Inventor 卢双豪于洋
Owner BEIJING DREAM INK TECH CO LTD
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