Lens coupling equipment for multi-path single-mode COB module

Abstract

The invention provides lens coupling equipment for a multi-path single-mode COB module. The lens coupling equipment comprises a lens feeding assembly, a lens clamp assembly, a PCB clamping assembly, adispensing module, a curing module and a visual detection module, wherein a plurality of lenses are pre-installed in the lens feeding assembly, the lenses are fed in sequence, the lens clamp assemblyclamps the lens fed by the lens feeding assembly and moves the lens to a corresponding packaging position on a PCB so as to be coupled with a light-emitting element and a receiving element on the PCB, the PCB is clamped and fixed by the PCB clamping assembly, the dispensing module dispenses glue to the coupled lens, the curing module cures the dispensed lens, and the visual detection module is used for visually detecting the lens feeding and coupling process. The lens is sequentially clamped to the surface of the PCB through the lens clamping assembly in an automatic feeding mode, automatic coupling, dispensing and curing are carried out one by one, the structural design is reasonable, the connection and cooperation are compact, and the lens coupling efficiency, precision and packaging quality are effectively improved.

Description

technical field [0001] The invention relates to the technical field of COB, in particular to a lens coupling device for a multi-channel single-mode COB module. Background technique [0002] COB (Chip-on-Board), also known as direct chip mounting technology, refers to the method of directly pasting bare chips on the printed circuit board PCB, then performing wire bonding, and then using organic glue to protect the chip and leads. craft. Compared with the traditional process, COB has the following advantages: eliminates the requirement for wire bonding connection, increases the connection density, and makes the product performance more stable and reliable; eliminates the link pins between the chip and the application circuit board, and improves the product reliability. Integration; it can be bonded and mounted on both sides of the PCB, correspondingly reducing the size of the application module and expanding the application space of the COB module; stronger ease of use, more ...

AI Technical Summary

Problems solved by technology

Therefore, the accuracy of lens coupling and the quality of dispensing and curing significantly affect the packaging quality of COB modules

At the same time, there are many packaging positions for the lens on the PCB, and the lens is a small micro-lens, which makes the storage, loading and coupling process of the lens more sophisticated and complicated, and it is difficult to meet the above-mentioned COB module packaging with conventional equipment. Process requirements

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