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Self-repairable epoxy resin and preparation method thereof

An epoxy resin and self-repair technology, which is applied in the field of self-repairable epoxy resin and its preparation, can solve the problems of poor mechanical properties, low repair efficiency, long repair time, etc., and achieve good self-repair function and self-repair efficiency High and simple preparation process

Pending Publication Date: 2020-07-03
刘云晖
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, the introduction method and preparation process of introducing self-healing groups into the epoxy resin chain segment are complex and cumbersome, and the cost is high; in addition, most self-healing epoxy resins have poor mechanical properties, and some self-healing groups with better mechanical properties Epoxy resin materials have problems such as long repair time and low repair efficiency.
These issues limit the widespread application of self-healing epoxy materials

Method used

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  • Self-repairable epoxy resin and preparation method thereof
  • Self-repairable epoxy resin and preparation method thereof
  • Self-repairable epoxy resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] (A) Mix 30g of N,N'-thiocarbonyldiimidazole, 10g of 1,2-bis(2-aminoethoxy)ethane, and 20g of ethanol, and react at 40°C for 4h to obtain a pre-reaction liquid;

[0050] (B) Stir and mix the pre-reaction solution with 100g of epoxy resin (glycidyl ester type epoxy resin) evenly; at 50°C, stir and react for 100 min, and then vacuum defoam to obtain a self-healing epoxy resin .

[0051] as attached figure 1 As shown, the resulting self-healing epoxy was disconnected and re-contacted, and the material healed and repaired within 2 minutes. It can be seen that after a short period of room temperature exposure, efficient healing can be achieved.

Embodiment 2

[0053] (A) Mix 40 g of N,N'-thiocarbonyldiimidazole, 10 g of triethylene glycol bis(2-aminoethyl) ether, and 5 g of methanol, and react at 60°C for 4 hours to obtain a pre-reaction solution;

[0054] (B) Stir and mix the pre-reaction solution with 100g of epoxy resin (bisphenol A epoxy resin); at 40°C, stir and react for 80 min, followed by vacuum defoaming to obtain a self-healing epoxy resin .

[0055] The resulting self-healing epoxy was disconnected and re-contacted, and the material healed within a minute. It can be seen that after a short period of room temperature exposure, efficient healing can be achieved.

Embodiment 3

[0057] (A) Mix 10 g of N,N'-thiocarbonyldiimidazole, 2 g of ethylene glycol mono(2-aminoethyl) ether, and 10 g of n-butanol, and react at 40°C for 3 hours to obtain a pre-reaction solution ;

[0058] (B) Stir and mix the pre-reaction solution with 100g of epoxy resin (bisphenol F epoxy resin); stir and react for 120 min at 60°C, and then vacuum defoam to obtain a self-healing epoxy resin .

[0059]The resulting self-healing epoxy was disconnected and re-contacted, and the material healed within 4 minutes. It can be seen that after a short period of room temperature exposure, efficient healing can be achieved.

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Abstract

The invention discloses self-repairable epoxy resin and a preparation method thereof. A diimidazole compound, polyamine, a diluent and epoxy resin are mixed to carry out reactions so as to introduce thiourea groups, urea groups and other hydrogen bond groups into an epoxy resin polymer chain segment, self-repairing of epoxy resin is achieved by means of breaking and recombination of intra-molecular or intermolecular hydrogen bonds, and therefore epoxy resin has a good self-repairing function. The self-repairing epoxy resin is high in self-repairing efficiency, simple in preparation process andlow in cost.

Description

technical field [0001] The invention belongs to the field of epoxy resin and its preparation, in particular to a self-repairable epoxy resin and its preparation method. Background technique [0002] The information disclosed in this background section is only intended to increase the understanding of the general background of the present invention, and is not necessarily taken as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. [0003] Epoxy resin is one of the most widely used thermosetting resins. It has the characteristics of strong adhesion, small shrinkage, good corrosion resistance, excellent electrical properties, good durability, easy modification and easy access to raw materials. With the rapid development of national construction and the continuous birth of new fields, higher requirements are put forward for the functional development of epoxy resin. In many studies on epoxy resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50
CPCC08G59/50C08G59/5013C08G59/5026C08G59/504
Inventor 刘云鸿彭新艳刘云晖
Owner 刘云晖
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